Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Micron Technology |
零件包装代码 | TSOP |
包装说明 | 0.300 INCH, PLASTIC, TSOP-26/20 |
针数 | 20 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
长度 | 17.14 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 20 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX4 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSSOP20/26,.36 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
座面最大高度 | 1.2 mm |
自我刷新 | NO |
最大待机电流 | 0.0002 A |
最大压摆率 | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
MT4C4001JTG-7L | MT4C4001JDJ-7L | MT4C4001JTG-6L | MT4C4001JDJ-6L | MT4C4001JZ-6L | MT4C4001JDJ-8L | MT4C4001JZ-7L | MT4C4001JTG-8L | MT4C4001JZ-8L | |
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描述 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP | SOJ | TSOP | SOJ | ZIP | SOJ | ZIP | TSOP | ZIP |
包装说明 | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.400 INCH, PLASTIC, ZIP-20 | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.400 INCH, PLASTIC, ZIP-20 | 0.300 INCH, PLASTIC, TSOP-26/20 | 0.400 INCH, PLASTIC, ZIP-20 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown | unknown | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 70 ns | 60 ns | 60 ns | 60 ns | 80 ns | 70 ns | 80 ns | 80 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-J20 | R-PZIP-T20 | R-PDSO-J20 | R-PZIP-T20 | R-PDSO-G20 | R-PZIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 17.14 mm | 17.17 mm | 17.14 mm | 17.17 mm | 25.295 mm | 17.17 mm | 25.295 mm | 17.14 mm | 25.295 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOJ | TSOP2 | SOJ | ZIP | SOJ | ZIP | TSOP2 | ZIP |
封装等效代码 | TSSOP20/26,.36 | SOJ20/26,.34 | TSSOP20/26,.36 | SOJ20/26,.34 | ZIP20,.1 | SOJ20/26,.34 | ZIP20,.1 | TSSOP20/26,.36 | ZIP20,.1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 1.2 mm | 3.61 mm | 1.2 mm | 3.61 mm | 10.41 mm | 3.61 mm | 10.41 mm | 1.2 mm | 10.41 mm |
自我刷新 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
最大待机电流 | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
最大压摆率 | 0.1 mA | 0.1 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.09 mA | 0.1 mA | 0.09 mA | 0.09 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | J BEND | GULL WING | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.67 mm | 7.62 mm | 7.67 mm | 2.795 mm | 7.67 mm | 2.795 mm | 7.62 mm | 2.795 mm |
是否无铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
厂商名称 | Micron Technology | - | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
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