1N4148WS/1N4448WS/1N914BWS
200mW High Speed SMD Switching Diode
Small Signal Diode
SOD-323
B
Features
Fast switching device(T
rr
<4.0nS)
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
C
A
D
E
F
Mechanical Data
Case : Flat lead SOD-323F small outline plastic package
Terminal: Matte tin plated, solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Polarity : Indicated by cathode band
Weight : 4.85±0.5 mg
Marking Code : S1, S2, S3
Dimensions
A
B
C
D
E
F
Unit (mm)
Min
1.15
2.30
0.25
1.60
0.80
0.05
Max
1.35
2.70
0.40
1.80
1.00
0.20
Unit (inch)
Min
0.091
0.010
Max
0.106
0.016
0.045 0.053
0.063 0.071
0.031 0.039
0.002 0.008
Ordering Information
Package
Part No.
Packing
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
Marking
S1
S2
S3
S1
S2
S3
SOD-323F 1N4148WS RR
SOD-323F 1N4448WS RR
SOD-323F 1N914BWS RR
SOD-323F 1N4148WS RRG
SOD-323F 1N4448WS RRG
SOD-323F 1N914BWS RRG
Pin Configuration
Suggested PAD Layout
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Reverse Voltage
Reverse Voltage
Non-Repetitive Peak Forward Current
Mean Forward Current
Thermal Resistance (Junction to Ambient)
Junction and Storage Temperature Range
Symbol
P
D
V
RRM
V
R
I
FRM
I
O
RθJA
T
J
, T
STG
Value
200
100
100
300
150
500
-65 to + 150
Units
mW
V
V
mA
mA
°C/W
°C
Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Version : F12
1N4148WS/1N4448WS/1N914BWS
200mW High Speed SMD Switching Diode
Small Signal Diode
Electrical Characteristics
Type Number
Reverse Breakdown Voltage
Forward Voltage
1N4448WS, 1N914BWS
1N4148WS
1N4448WS, 1N914BWS
Reverse Leakage Current
Junction Capacitance
Reverse Recovery Time
I
R
= 100uA
I
R
= 5uA
I
F
= 5.0mA
I
F
= 10.0mA
I
F
= 100.0mA
V
R
= 20V
V
R
= 75V
V
R
=0, f=1.0MHz
I
F
=10mA, I
R
=60mA, R
L
=100Ω, I
RR
=1mA
Symbol
V
(BR)
Min
100
75
0.62
-
-
-
-
-
-
Max
-
-
0.72
1.0
1.0
25
5.0
4.0
4.0
Units
V
V
F
V
nA
μA
pF
ns
I
R
C
J
Trr
Tape & Reel specification
TSC label
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
Item
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
K
D
A
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
2.40 Max.
1.5 ± 0.1
178 ± 1
50 Min.
13.0 ± 0.5
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.10
0.6 Max.
8.30 Max.
14.4 Max
W1
A
D2
D1
User Direction of Feed
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10° within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : F12
1N4148WS/1N4448WS/1N914BWS
200mW High Speed SMD Switching Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Forward Voltage vs Forward Current
1.40
1.20
100
FIG 2 Reverse Current vs Reverse Voltage
Forward Voltage (V)
Reverse Current (uA)
1.00
0.80
0.60
0.40
0.20
0.00
0.01
0.1
1
10
100
1000
125°
25°C
10
Ta=25°C
1
0.1
0.01
0
20
40
60
80
100
120
Forward Current (mA)
Reverse Voltage (V)
FIG 3 Admissible Power Dissipation Curve
250
1.2
V
R
=0V
Tj=25°C
f=1MHz
1.1
1.1
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0
25
50
75
100
125
150
175
0
1
FIG 4 Typical Junction Capacitance
200
150
100
50
0
Junction Capacitance (pF)
Power Dissipation (mW)
2
3
4
5
6
7
8
9
10
Ambient Temperature (°C)
Reverse Voltage (V)
Version : F12
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