IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDSO8, MINI, PLASTIC, SOT-96A, SOP-8, Digital to Analog Converter
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 最大模拟输出电压 | 2.2 V |
| 最小模拟输出电压 | 1.8 V |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | 2\'S COMPLEMENT BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.9 mm |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 标称安定时间 (tstl) | 0.2 µs |
| 最大压摆率 | 6 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| TDA1312TD | TDA1312TD-T | TDA1312P | TDA1312T-T | TDA1312PN | TDA1312T | |
|---|---|---|---|---|---|---|
| 描述 | IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDSO8, MINI, PLASTIC, SOT-96A, SOP-8, Digital to Analog Converter | IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDSO8, MINI, PLASTIC, SOT-96A, SOP-8, Digital to Analog Converter | IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDIP8, Digital to Analog Converter | IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDSO8, MINI, PLASTIC, SOT-96A, SOP-8, Digital to Analog Converter | IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDIP8, Digital to Analog Converter | IC SERIAL INPUT LOADING, 0.2 us SETTLING TIME, 16-BIT DAC, PDSO8, MINI, PLASTIC, SOT-96A, SOP-8, Digital to Analog Converter |
| 包装说明 | SOP, | SOP, | DIP, | SOP, | DIP, | SOP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最大模拟输出电压 | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| 最小模拟输出电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | 2\'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 9.5 mm | 4.9 mm | 9.5 mm | 4.9 mm |
| 位数 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 4.2 mm | 1.75 mm | 4.2 mm | 1.75 mm |
| 标称安定时间 (tstl) | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs |
| 最大压摆率 | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOIC | SOIC | - | SOIC | - | SOIC |
| 针数 | 8 | 8 | - | 8 | - | 8 |
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