Latch Based Peripheral Driver, BIMOS, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Micrel ( Microchip ) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 内置保护 | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LATCH BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 长度 | 11.4554 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 8 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | OPEN-COLLECTOR |
| 输出电流流向 | SINK |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.318 mm |
| 最小供电电压 | 3 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BIMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 11.4554 mm |
| MIC58P01BVT&R | MIC58P01AJ | MIC58P01AJBQ | MIC58P01BWMT&R | |
|---|---|---|---|---|
| 描述 | Latch Based Peripheral Driver, BIMOS, PQCC28, PLASTIC, LCC-28 | Latch Based Peripheral Driver, 8 Driver, 0.5A, BIMOS, CDIP22, CERAMIC, DIP-22 | Latch Based Peripheral Driver, 0.5A, CDIP22, CERAMIC, DIP-22 | Latch Based Peripheral Driver, BIMOS, PDSO24, SOIC-24 |
| 厂商名称 | Micrel ( Microchip ) | Micrel ( Microchip ) | Micrel ( Microchip ) | Micrel ( Microchip ) |
| 零件包装代码 | QLCC | DIP | DIP | SOIC |
| 包装说明 | QCCJ, | DIP, DIP22,.4 | DIP, | SOP, |
| 针数 | 28 | 22 | 22 | 24 |
| Reach Compliance Code | compliant | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 内置保护 | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE |
| 接口集成电路类型 | LATCH BASED PERIPHERAL DRIVER | LATCH BASED PERIPHERAL DRIVER | LATCH BASED PERIPHERAL DRIVER | LATCH BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-PQCC-J28 | R-GDIP-T22 | R-GDIP-T22 | R-PDSO-G24 |
| 长度 | 11.4554 mm | 27.178 mm | 27.178 mm | 15.4 mm |
| 功能数量 | 8 | 1 | 1 | 8 |
| 端子数量 | 28 | 22 | 22 | 24 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C |
| 输出电流流向 | SINK | SINK | SINK | SINK |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | SOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.318 mm | 5.08 mm | 5.08 mm | 2.65 mm |
| 表面贴装 | YES | NO | NO | YES |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 11.4554 mm | 10.16 mm | 10.16 mm | 7.5 mm |
| 输入特性 | STANDARD | STANDARD | - | STANDARD |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | - | OPEN-COLLECTOR |
| 输出极性 | INVERTED | INVERTED | - | INVERTED |
| 最小供电电压 | 3 V | - | 3 V | 3 V |
| 标称供电电压 | 5 V | - | 5 V | 5 V |
| 技术 | BIMOS | BIMOS | - | BIMOS |
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