电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MASMBG9.0C

产品描述Trans Voltage Suppressor Diode, 600W, 9V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AA, PLASTIC PACKAGE-2
产品类别分立半导体    二极管   
文件大小177KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

MASMBG9.0C概述

Trans Voltage Suppressor Diode, 600W, 9V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AA, PLASTIC PACKAGE-2

MASMBG9.0C规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Microsemi
零件包装代码DO-215AA
包装说明R-PDSO-G2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
最大击穿电压12.2 V
最小击穿电压10 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-215AA
JESD-30 代码R-PDSO-G2
JESD-609代码e0
最大非重复峰值反向功率耗散600 W
元件数量1
端子数量2
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性BIDIRECTIONAL
最大功率耗散1.38 W
认证状态Not Qualified
最大重复峰值反向电压9 V
表面贴装YES
技术AVALANCHE
端子面层TIN LEAD
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

文档预览

下载PDF文档
SMBJ5.0 thru SMBJ170A, CA, e3
and SMBG5.0 thru SMBG170A, CA, e3
SCOTTSDALE DIVISION
SURFACE MOUNT 600 Watt
Transient Voltage Suppressor
DESCRIPTION
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
components from destruction or degradation. It is available in J-bend design
(SMBJ) with the DO-214AA package for greater PC board mounting density or
in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.
It is also available in both unidirectional and bidirectional configurations with a
C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their
response time is virtually instantaneous. As a result, they can be used for
protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for
inductive switching environments and induced RF protection. They can also
protect from secondary lightning effects per IEC61000-4-5 and class levels
defined herein. Microsemi also offers numerous other TVS products to meet
higher and lower power demands and special applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Available in both unidirectional and bidirectional
construction (add C or CA suffix for bidirectional)
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Optional 100%
screening for avionics grade
is available
by adding MA prefix to part number for 100% temperature
cycle -55
o
C to +125
o
C (10X) as well as surge (3X) and 24
hours HTRB with post test V
Z
& I
R
(in operating direction
for unidirectional or both directions for bidirectional)
Options for screening in accordance with MIL-PRF-19500
for JANTX are available by adding MX prefix to the part
number.
Axial-lead equivalent packages for thru-hole mounting
available as P6KE6.8 to P6KE200CA (consult factory for
other surface mount options)
Moisture classification is Level 1 with no dry pack required
per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
APPLICATIONS / BENEFITS
Economical surface mount design in both J-bend or
Gull-wing terminations
Protects sensitive components such as IC’s, CMOS,
2
Bipolar, BiCMOS, ECL, DTL, T L, etc.
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
ESD and EFT protection respectively
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1: SMB 5.0 to SMB 120A or CA
Class 2: SMB 5.0 to SMB 60A or CA
Class 3: SMB 5.0 to SMB 30A or CA
Class 4: SMB 5.0 to SMB 15A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1: SMB 5.0 to SMB 36A or CA
Class 2: SMB 5.0 to SMB 18A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 600 watts at
10/1000
μs
(also see Fig 1,2, and 3).
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
º
C to +150
º
C
Thermal resistance: 25
º
C/W junction to lead, or 90
º
C/W
junction to ambient when mounted on FR4 PC board (1oz
Cu) with recommended footprint (see last page)
o
Steady-State Power dissipation: 5 watts at T
L
= 25 C, or
1.38 watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint
Forward Surge at 25ºC: 100 Amps peak impulse of 8.3
ms half-sine wave (unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
©
2009
SA3-37, REV J, 5-24-2009
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
tin-lead or RoHS compliant annealed matte-tin plating
solderable per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. No marking
on bi-directional devices
MARKING: Part number without standard prefix (e.g.
5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)
TAPE & REEL option: Standard per EIA-481-1-A with
12 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimension on last page
SMB5.0– 170AC, e3
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
我做了这个程序帮我看下哪里错了
#include<reg51.h>#define uchar unsigned char#define uint unsigned int // #define r0 P1 void xs(uchar nian0,uchar nian1,uchar nian2,uchar nian3,uchar yue0,uchar yue1,uchar ri0 ......
ylf175300 51单片机
手机摄像头开发的问题
请问手机上摄像头的开发流程,自己开发程序启动摄像头,截取摄像头的图片,保存在手机中。 在 wincetools 里面的那个win32下的sample貌似不能用啊,不能截获到图片的数据,是吗? 需要安 ......
suweibus 嵌入式系统
有关运放的问题
我用LM358运放模拟一个最简单的负反馈跟随电路,仿真的时候是完全没有问题的,可为什么一实践就出问题,始终不满足虚短要求,他的2脚始终不为低,当VCC=5V时,2叫电位为2.8V,当VCC=0.8V时,2脚 ......
你好协同 模拟电子
有做过MPC8260 I2C控制器的大虾请进!
请问一下,MPC8260的I2C控制器是否需要烧入微码才能使用啊?如果需要,如何才能查看到微码是否已经烧入呢? 我已经按照MPC的用户手册将寄存器和DPRAM参数配置成功,但是始终未能成功通信,连最基本 ......
felixty 嵌入式系统
18B20使用源代码
18B20使用源代码。分享一下!...
伤逝 微控制器 MCU
【分享】功率变换器电磁干扰及其相关电磁基础
课程介绍 电磁干扰问题是电力电子功率变换器的关键技术之一,它与电磁技术密切相关,其本质是电磁场问题,与磁性元件关系密切,从电磁场观点可以更深入更本质地理解电磁干扰问题。本章将介绍电 ......
arui1999 电源技术

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2785  597  1386  1850  2138  57  13  28  38  44 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved