580 Pleasant St.
Watertown, MA 02472
PH: (617) 926-0404
FAX: (617) 924-1235
UPS120E
PRELIMINARY
SURFACE MOUNT
1A SCHOTTKY RECTIFIER
POWERMITE® Power Surface Mount Package
®
Features:
•
•
•
•
•
Low Profile -- Maximum Height of 1.1 mm
Small Footprint -- Footprint Area of 8.45 mm
2
Low V
F
Provides Higher Efficiency and Extends Battery Life
Supplied in 12 mm Tape and Reel -- 12,000 Units per Reel
Low Thermal Resistance with Direct Thermal Path of Die on Exposed
Cathode Heat Sink
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
20 VOLTS
Mechanical Characteristics:
•
•
•
•
•
•
•
Powermite is JEDEC Registered as DO-216AA
Case: Molded Epoxy
Epoxy Meets UL94, VO at 1/8"
Weight: 62 mg (appoximately)
Device Marking: S20
Lead and Mounting Surface Temperature for Soldering Purposes,
260°C Maximum for 10 Seconds
°
Description:
The UPS120E Powermite Schottky rectifier is designed to offer optimized reverse leakage characteristics for
battery powered portable products such as cellular and cordless phones, chargers, notebook computers,
printers, PDA's and PCMCIA cards. Typical applications include ac/dc and dc-dc converters, reverse battery
protection and "Oring" of multiple supply voltages.
The Powermite's patented heat sink design offers the same thermal performance rating as an SMA while being
50% smaller in footprint area and less than 1 mm in overall height. The result is a unique, highly efficient
Schottky rectifier in a space saving surface mount package.
Maximum Ratings
RATING
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (At Rated V
R,
T
C
= 130°C)
°
Peak Repetitive Forward Current
(At Rated V
R
, Square Wave, 20 KHz, T
C
= 135°C
°
Non-Repetitive Peak Surge Current
(Non-Repetitive peak surge current, halfwave, single phase, 60 Hz)
Storage / Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated V
R
, T
J
= 25°C)
°
SYMBOL
V
RRM
V
RWM
V
R
I
O
I
FRM
I
FSM
T
stg,
T
C
T
J
dv/dt
VALUE
20
UNIT
V
1.0
2.0
50
-55 to 150
-55 to 125
10,000
35
15
248
A
A
A
°
C
°
C
V/µs
µ
°
C/W
Thermal Characteristics
Thermal Resistance - Junction-to-Lead (Anode) (1)
Thermal Resistance - Junction-to-Tab (Cathode) (1)
Thermal Resistance - Junction-to-Ambient (1)
(1) Pulse Test: Pulse Width
≤
250
µ
s, Duty Cycle
≤
2%.
MSC1360.PDF 02-16-99
R
tjl
R
tjtab
R
tja
PCB设计
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