F-219
FLE–110–01–G–DV
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
FLE–120–01–G–DV
FLE–150–01–G–DV
(1.27 mm) .050"
FLE SERIES
COST-EFFECTIVE RELIABLE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FLE
Insulator Material:
Black Liquid
Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
2.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(1.83 mm) .072" to
(4.37 mm) .172" or
pass-through
Normal Force:
100 grams (0.98 N)
Max Cycles:
100+
RoHS Compliant:
Yes
Board Mates:
FTSH, FTS, FW
Cable Mates:
FFMD
*
, FMTP
Tiger Beam
™
contact
Ideal for
pass-through
applications
Surface
mount
*
Note:
Standard FFMD callout
Available with optional
pick & place pads
(1.27 mm) .050"
micro pitch
will not mate with FLE, SFMC.
Must use gold plated callouts.
(See drawing on web.)
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max
FLE
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTIONS
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
02 thru 50
= 10 µ" (0.25 µm) Gold
–G
= Alignment Pin
(Metal or plastic at
Samtec discretion)
(3 positions minimum)
–A
FILE NO. E111594
= (4.25 mm) .167" DIA
Polyimide film
Pick & Place Pad
(5 positions minimum)
–K
ALSO AVAILABLE
(MOQ Required)
• Other platings
(3.33)
.131
(0.51)
.020
No. of Positions x (1.27) .050 + (0.11) .0045
(1.27)
.050
(1.27)
.050
(4.74)
.187
(6.35)
.250
x
(4.17)
.164
= Metal Pick &
Place Pad
(5 positions minimum)
–P
= Tape & Reel
–TR
–P OPTION
(4.55) (4.36)
.179 .172
(4.60)
.181
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
