4. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
5. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
6. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
ψ
JB
and
θ
JA
values
are determined for a 4-layer board in still-air number, unless otherwise stated.
7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
8. Due to the internal termination (see "Input Buffer Structure" section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do
not apply a combination of voltages that causes the input current to exceed the maximum limit!
Parameter
Power Supply Voltage Range
Power Supply Current
Input Resistance (IN-to-VT)
Differential Input Resistance
(IN-to-/IN)
Input HIGH Voltage
(IN-to-/IN)
Input LOW Voltage
(IN-to-/IN)
Input Voltage Swing
(IN-to-/IN)
Differential Input Voltage
Input Current
IN, /IN
Reference Voltage
Condition
Min.
3.0
Typ.
3.3
75
Max.
3.6
100
55
110
V
CC
+ 0.3
V
IH
– 0.1
V
CC
Units
V
mA
Ω
Ω
V
V
V
V
No load, max. V
CC
45
90
0.1
-0.3
Note 8,
see Figure 2c.
Note 8,
see Figure 2d.
Note 8.
V
CC
- 1.525
0.1
0.2
50
100
45
V
CC
- 1.425
V
CC
- 1.325
mA
V
May 5, 2014
4
050514-2.0
hbwhelp@micrel.com
or (408) 955-1690
Micrel, Inc.
SY89833L
LVDS Outputs DC Electrical Characteristics
(9)
V
CC
= 3.3V±10%, R
L
= 100Ω across the outputs; T
A
= -40°C to +85°C.
Symbol
V
OUT
V
DIFF_OUT
V
OCM
∆V
OCM
Parameter
Output Voltage Swing
Differential Output Voltage Swing
Output Common Mode Voltage
Change in Common Mode
Voltage
Condition
See Figure 2c.
See Figure 2d.
Min
250
500
1.125
-50
Typ
325
650
1.275
50
Max
Units
mV
mV
V
mV
LVTTL/CMOS DC Electrical Characteristics
(9)
V
CC
= 3.3V±10%, T
A
= -40°C to +85°C.
Symbol
V
IH
V
IL
I
IH
I
IL
Note:
9. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
Parameter
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
Condition
Min
2.0
0
-125
Typ
Max
V
CC
0.8
30
-300
Units
V
V
V
mV
AC Electrical Characteristics
(10)
V
CC
= 3.3V±10%, R
L
= 100Ω across the outputs; T
A
= -40°C to +85°C unless otherwise stated.
Symbol
f
MAX
t
pd
Parameter
Maximum Frequency
Propagation Delay
IN-to-Q
IN-to-Q
Condition
V
OUT
≥ 200mV
V
IN
< 400mV
V
IN
≥ 400mV
Note 11
Note 12
EN to IN, /IN
EN to IN, /IN
Note 13
Note 13
Output = 622MHz
Integration range: 12kHz – 20MHz
At full output swing.
60
300
500
150
110
190
Min
2.0
400
330
500
440
4
600
530
20
200
Typ
Max
Units
GHz
ps
ps
ps
ps
ps
ps
fs
ps
t
SKEW
Within-Device Skew
Part-to-Part Skew
t
S
t
H
t
JITTER
t
r
, t
f
Notes:
Set-up Time
Hold Time
Additive Jitter
Output Rise/Fall Times
(20% to 80%)
10. High-frequency AC parameters are guaranteed by design and characterization.
11. Within device skew is measured between two different outputs under identical input transitions.
12. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and no skew at the edges at the respective
inputs.
13. Set-up and hold times apply to synchronous applications that intend to enable/disable before the next clock cycle. For asynchronous applications,
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