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IDT72T51553L7-5BB

产品描述FIFO, 128KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
产品类别存储    存储   
文件大小205KB,共12页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72T51553L7-5BB概述

FIFO, 128KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51553L7-5BB规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA,
针数256
Reach Compliance Codenot_compliant
ECCN代码EAR99
周期时间7.5 ns
JESD-30 代码S-PBGA-B256
JESD-609代码e0
长度17 mm
内存密度2359296 bit
内存宽度18
湿度敏感等级3
功能数量1
端子数量256
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX18
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度3.5 mm
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度17 mm

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2.5V MULTI-QUEUE FIFO (32 QUEUES)
18 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
ADVANCE INFORMATION
IDT72T51543
IDT72T51553
FEATURES:
Choose from among the following memory density options:
IDT72T51543
Total Available Memory = 1,179,648 bits
IDT72T51553
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 512 x 18 or 1,024 x 9
Independent Read and Write access per queue
User selectable I/O: 2.5V LVTTL, 1.5V HSTL, 1.8V eHSTL
User programmable via serial port
Default Multi-Queueueue device configurations
-IDT72T51543: 2,048 x 18 x 32Q
-IDT72T51553: 4,096 x 18 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Echo Read Enable & Echo Read Clock Outputs
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
- x18in to x18out
- x9in to x18out
- x18in to x9out
- x9in to x9out
FWFT mode of operation on read port
Partial Reset, clears data in single Queue
Expansion of up to 8 Multi-Queue devices in parallel is available
Power Down Input provides additional power savings in HSTL
and eHSTL modes.
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
DATA PATH FLOW DIAGRAM
MULTI-QUEUE FIFO
WADEN
FSTR
WRADD
8
Q0
READ CONTROL
8
RADEN
ESTR
RDADD
REN
RCLK
WRITE CONTROL
Q1
WEN
WCLK
EREN
ERCLK
OE
Q2
Din
Qout
x9, x18
DATA IN
FF
PAF
PAFn
x9, x18
DATA OUT
READ FLAGS
OV
PAE
PAEn
8
WRITE FLAGS
Qmax
8
5999 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2001
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 2, 2001
DSC-5999/-

IDT72T51553L7-5BB相似产品对比

IDT72T51553L7-5BB IDT72T51543L7-5BBI IDT72T51543L7-5BB IDT72T51553L7-5BBI
描述 FIFO, 128KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX18, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA BGA BGA
包装说明 BGA, BGA, BGA, BGA,
针数 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
周期时间 7.5 ns 7.5 ns 7.5 ns 7.5 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609代码 e0 e0 e0 e0
长度 17 mm 17 mm 17 mm 17 mm
内存密度 2359296 bit 1179648 bit 1179648 bit 2359296 bit
内存宽度 18 18 18 18
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端子数量 256 256 256 256
字数 131072 words 65536 words 65536 words 131072 words
字数代码 128000 64000 64000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 85 °C
组织 128KX18 64KX18 64KX18 128KX18
可输出 YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.5 mm 3.5 mm 3.5 mm 3.5 mm
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 20 20 20
宽度 17 mm 17 mm 17 mm 17 mm

 
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