Flash Module, 1MX32, 120ns,
参数名称 | 属性值 |
厂商名称 | EDI [Electronic devices inc.] |
Reach Compliance Code | unknown |
最长访问时间 | 120 ns |
JESD-30 代码 | R-XSMA-N80 |
内存密度 | 33554432 bit |
内存集成电路类型 | FLASH MODULE |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 80 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 1MX32 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL |
编程电压 | 5 V |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | NO LEAD |
端子位置 | SINGLE |
类型 | NOR TYPE |
EDI7F331MC120BNI | EDI7F331MC100BNC | EDI7F331MC150BNC | EDI7F331MC100BNI | EDI7F331MC150BNI | EDI7F331MC120BNC | |
---|---|---|---|---|---|---|
描述 | Flash Module, 1MX32, 120ns, | Flash Module, 1MX32, 100ns, | Flash Module, 1MX32, 150ns, | Flash Module, 1MX32, 100ns, | Flash Module, 1MX32, 150ns, | Flash Module, 1MX32, 120ns, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 120 ns | 100 ns | 150 ns | 100 ns | 150 ns | 120 ns |
JESD-30 代码 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 |
内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 80 | 80 | 80 | 80 | 80 | 80 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
组织 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
厂商名称 | EDI [Electronic devices inc.] | - | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
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