Dual-Port SRAM, 32KX8, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
参数名称 | 属性值 |
厂商名称 | IDT (Integrated Device Technology) |
包装说明 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 15 ns |
其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 代码 | S-PQFP-F100 |
内存密度 | 262144 bit |
内存集成电路类型 | DUAL-PORT SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 32768 words |
字数代码 | 32000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFF |
封装形状 | SQUARE |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | FLAT |
端子位置 | QUAD |
709079S15PFI | 709079L9PFI | 709079S12PFI | 709079S12PFI8 | |
---|---|---|---|---|
描述 | Dual-Port SRAM, 32KX8, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Application Specific SRAM, 32KX8, 20ns, CMOS, PQFP100 | Dual-Port SRAM, 32KX8, 12ns, CMOS, PQFP100, 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 | Multi-Port SRAM, 32KX8, 25ns, CMOS, PQFP100 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Reach Compliance Code | compliant | not_compliant | not_compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 15 ns | 20 ns | 12 ns | 25 ns |
JESD-30 代码 | S-PQFP-F100 | S-PQFP-G100 | S-PQFP-F100 | S-PQFP-G100 |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | DUAL-PORT SRAM | APPLICATION SPECIFIC SRAM | DUAL-PORT SRAM | MULTI-PORT SRAM |
内存宽度 | 8 | 8 | 8 | 8 |
端子数量 | 100 | 100 | 100 | 100 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFF | QFP | QFF | QFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | FLAT | GULL WING | FLAT | GULL WING |
端子位置 | QUAD | QUAD | QUAD | QUAD |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
最大时钟频率 (fCLK) | - | 66 MHz | 50 MHz | 50 MHz |
I/O 类型 | - | COMMON | COMMON | COMMON |
端口数量 | - | 2 | 2 | 2 |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE |
封装等效代码 | - | QFP100,.63SQ,20 | QFP100,.63SQ,20 | QFP100,.63SQ,20 |
电源 | - | 5 V | 5 V | 5 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
最小待机电流 | - | 4.5 V | 4.5 V | 4.5 V |
端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm |
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