74HCT147PW概述

IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit

74HCT147PW规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
包装说明	TSSOP,
Reach Compliance Code	unknown
其他特性	9 TO 4 LINE PRIORITY ENCODER
系列	HCT
JESD-30 代码	R-PDSO-G16
长度	5 mm
负载电容（CL）	50 pF
逻辑集成电路类型	ENCODER
位数	9
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟（tpd）	53 ns
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
宽度	4.4 mm

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74HCT147PW相似产品对比

	74HCT147PW	74HC147NB	74HCT147NB	74HCT147DB	74HCT147DB-T	74HCT147PW-T	74HC147PW-T	74HC147PW
描述	IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit	IC HC/UH SERIES, 9-BIT ENCODER, PDIP16, Arithmetic Circuit	IC HCT SERIES, 9-BIT ENCODER, PDIP16, Arithmetic Circuit	IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit	IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit	IC HCT SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit	IC HC/UH SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit	IC HC/UH SERIES, 9-BIT ENCODER, PDSO16, Arithmetic Circuit
包装说明	TSSOP,	DIP,	DIP,	SSOP,	SSOP,	TSSOP,	TSSOP,	TSSOP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER	9 TO 4 LINE PRIORITY ENCODER
系列	HCT	HC/UH	HCT	HCT	HCT	HCT	HC/UH	HC/UH
JESD-30 代码	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
长度	5 mm	19.025 mm	19.025 mm	6.2 mm	6.2 mm	5 mm	5 mm	5 mm
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER
位数	9	9	9	9	9	9	9	9
功能数量	1	1	1	1	1	1	1	1
端子数量	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	DIP	DIP	SSOP	SSOP	TSSOP	TSSOP	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟（tpd）	53 ns	48 ns	53 ns	53 ns	53 ns	53 ns	48 ns	48 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.1 mm	4.2 mm	4.2 mm	2 mm	2 mm	1.1 mm	1.1 mm	1.1 mm
最大供电电压 (Vsup)	5.5 V	6 V	5.5 V	5.5 V	5.5 V	5.5 V	6 V	6 V
最小供电电压 (Vsup)	4.5 V	2 V	4.5 V	4.5 V	4.5 V	4.5 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	NO	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	2.54 mm	2.54 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	4.4 mm	7.62 mm	7.62 mm	5.3 mm	5.3 mm	4.4 mm	4.4 mm	4.4 mm
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)
Base Number Matches	-	1	1	1	1	1	1	1

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