IC 64 X 16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-236/MO-252, UDFN-8, Programmable ROM
| 参数名称 | 属性值 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | SON |
| 包装说明 | HVSON, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 内存密度 | 1024 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 座面最大高度 | 0.55 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| CAT24C08C4AI-T3 | CAT24C08TDIT3 | CAT24C08LI | DBP-M999LF-02-8871-BA | CAT24C08WIT3 | CAT24C08VP2IT3 | CAT24C08YIT3 | CAT24C08ZIT3 | CAT24C08HU4E-T3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC 64 X 16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-236/MO-252, UDFN-8, Programmable ROM | 64X16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-229, TDFN-8 | 32X16 I2C/2-WIRE SERIAL EEPROM, PBGA5, 0.832 X 0.856 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, WLCSP-5 | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.2W, 8870ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 8726, | 64X16 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, PLASTIC, MS-001, DIP-8 | 64X16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-187, MSOP-8 | 64X16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MS-012, SOIC-8 | 64X16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-153, TSSOP-8 | IC 64 X 16 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, MO-236/MO-252, UDFN-8, Programmable ROM |
| Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compliant | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e4 | e4 | e3 | e3 | e4 | e4 | e4 | e4 | e3 |
| 端子数量 | 8 | 8 | 5 | 16 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 150 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR PACKAGE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | DIP | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 技术 | CMOS | CMOS | CMOS | TANTALUM NITRIDE/NICKEL CHROME | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Tin (Sn) | Matte Tin (Sn) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | MATTE TIN |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 零件包装代码 | SON | SON | BGA | - | DIP | TSSOP | SOIC | TSSOP | SON |
| 包装说明 | HVSON, | HVSON, | 0.832 X 0.856 MM, HALOGEN FREE, BFR FREE AND ROHS COMPLIANT, WLCSP-5 | - | DIP, | TSSOP, | SOP, | TSSOP, | HVSON, |
| 针数 | 8 | 8 | 5 | - | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PBGA-B5 | - | R-PDIP-T8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 |
| 长度 | 3 mm | 3 mm | 0.856 mm | - | 9.27 mm | 3 mm | 4.9 mm | 4.4 mm | 3 mm |
| 内存密度 | 1024 bit | 1024 bit | 512 bit | - | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 字数 | 64 words | 64 words | 32 words | - | 64 words | 64 words | 64 words | 64 words | 64 words |
| 字数代码 | 64 | 64 | 32 | - | 64 | 64 | 64 | 64 | 64 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 64X16 | 64X16 | 32X16 | - | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | HVSON | VFBGA | - | DIP | TSSOP | SOP | TSSOP | HVSON |
| 并行/串行 | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 座面最大高度 | 0.55 mm | 0.8 mm | 0.35 mm | - | 5.33 mm | 1.1 mm | 1.75 mm | 1.2 mm | 0.55 mm |
| 串行总线类型 | I2C | I2C | I2C | - | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | - | NO | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | BALL | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.3 mm | - | 2.54 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | BOTTOM | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2 mm | 2 mm | 0.832 mm | - | 7.62 mm | 3 mm | 3.9 mm | 3 mm | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | - | 260 | 260 | 260 | 260 | - |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | - | 40 | 40 | 40 | 40 | - |
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