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215RQA6AVA12FG: 产品描述Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共82页; 制造商AMD(超微); 官网地址http://www.amd.com; 标准

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215RQA6AVA12FG概述

Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465

215RQA6AVA12FG规格参数

参数名称	属性值
是否Rohs认证	符合
零件包装代码	BGA
包装说明	BGA, BGA465(UNSPEC)
针数	465
Reach Compliance Code	compli
JESD-30 代码	S-PBGA-B465
端子数量	465
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA465(UNSPEC)
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.2,1.8,3.3 V
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
端子形式	BALL
端子位置	BOTTOM
uPs/uCs/外围集成电路类型	MICROPROCESSOR
Base Number Matches	1

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AMD RS690

Databook

Technical Reference Manual

Rev. 3.04

P/N: 41977_rs690_ds

Please note that in this databook, references to "DVI" and "HDMI" may refer to: (1) the function of the integrated DVI/HDMI interface described in details in section 2.2.1 and

3.7, as well as in other sections; or (2) the capability of the TMDS interface, multiplexed on the PCI-E external graphics interface, to enable DVI or HDMI through passive

enabling circuitries. Any statement in this databook on any DVI or HDMI-related functionality must be understood to apply to (1), (2), or both, according to the immediate

context of the reference.

Advanced Micro Devices, Inc., will not provide any indemnity, pay any royalty, nor provide any license/sublicense to any:

(a) Intellectual property rights relating to any of the following: (i) Macrovision for its Analog Protection System ("APS") technologies; (ii) Advanced Television Systems

Committee (ATSC) standard and related technologies; or (iii) the High Definition Multimedia Interface (HDMI) standard and related technologies; or

(b) Audio and/or video codecs or any industry standard technology (e.g., technology or specifications promulgated by any standards development organization, consortium,

trade association, special interest group or like entity).

This device is protected by U.S. patent numbers 4,631,603, 4,577,216 and 4,819,098 and other intellectual property rights. The use of Macrovision's copy protection technology

in the device must be authorized by Macrovision and is intended for home and other limited pay-per-view uses only, unless otherwise authorized in writing by Macrovision.

Reverse engineering or disassembly is prohibited.

This device may only be sold or distributed to: (i) a Macrovision Authorized Buyer, (ii) a customer (PMA Customer) who has executed a Proprietary Materials Agreement

(PMA) with Macrovision that is still in effect, (iii) a contract manufacturer approved by Macrovision to purchase this device on behalf of a Macrovision Authorized Buyer or

a PMA Customer, or (iv) a distributor who has executed a Macrovision-specified distribution agreement with ATI.

Trademarks

AMD, the AMD Arrow logo, AMD Athlon, AMD Sempron, AMD Turion, AMD Xilleon, AMD Cool'n'Quiet, AMD PowerNow!, and combinations thereof, ATI, the ATI

logo, Radeon, Avivo, 3Dc, SmartShader HD, SmoothVision HD, HyperMemory, PowerPlay, and PowerShift are trademarks of Advanced Micro Devices, Inc.

HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.

Macrovision is a registered trademarks of Macrovision Corporation in the United States and/or other countries.

Microsoft, Windows, DirectX, Direct3D, DirectDraw, and ClearType are registered trademarks and Windows Vista is a trademark of Microsoft Corporation.

Macrovision is a registered trademarks of Macrovision Corporation in the United States and/or other countries.

OpenGL is a registered trademark of SGI.

PCI Express is a registered trademark of PCI-SIG.

WinBench is a registered trademark of Ziff Davis, Inc.

Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Disclaimer

The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect

to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.

No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD's Standard

Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the

implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications

intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or

environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.

Table of Contents

Chapter 1: Overview

1.1 Introducing the RS690

........................................................................................................................................................1-1

1.2 RS690C

...............................................................................................................................................................................1-2

1.3 RS690 Features

...................................................................................................................................................................1-2

1.3.1

CPU HyperTransport™ Interface.........................................................................................................................1-2

1.3.2

ATI HyperMemory™ Technology.......................................................................................................................1-2

1.3.3

PCI Express® Interface

.......................................................................................................................................1-2

1.3.4

A-Link Express II Interface..................................................................................................................................1-2

1.3.5

2D Acceleration Features

.....................................................................................................................................1-3

1.3.6

3D Acceleration Features

.....................................................................................................................................1-3

1.3.7

Motion Video Acceleration Features....................................................................................................................1-4

1.3.8

Multiple Display Features

....................................................................................................................................1-4

1.3.9

DVI/HDMI (Not applicable to the RS690C)........................................................................................................1-5

1.3.10 Power Management Features

...............................................................................................................................1-6

1.3.11 PC Design Guide Compliance..............................................................................................................................1-6

1.3.12 Test Capability Features

.......................................................................................................................................1-6

1.3.13 Packaging

.............................................................................................................................................................1-6

1.4 Software Features................................................................................................................................................................1-6

1.5 Branding Diagrams

.............................................................................................................................................................1-7

1.5.1

Branding Diagrams for ASIC Revision A11........................................................................................................1-7

1.5.2

Branding Diagrams for ASIC Revision A12 and After........................................................................................1-8

1.6 Part Number Legend

...........................................................................................................................................................1-9

1.7 Conventions and Notations

...............................................................................................................................................1-10

1.7.1

Pin Names...........................................................................................................................................................1-10

1.7.2

Pin Types

............................................................................................................................................................1-10

1.7.3

Numeric Representation

.....................................................................................................................................1-10

1.7.4

Register Field......................................................................................................................................................

1-11

1.7.5

Hyperlinks

.......................................................................................................................................................... 1-11

1.7.6

Acronyms and Abbreviations

............................................................................................................................. 1-11

Chapter 2: Functional Descriptions

2.1 Host Interface

......................................................................................................................................................................2-2

2.2 DVI/HDMI (Not Applicable to the RS690C)

.....................................................................................................................2-4

2.2.1

DVI/HDMI Data Transmission Order and Signal Mapping

................................................................................2-4

2.2.2

Support for HDMI Packet Types..........................................................................................................................2-7

2.3 VGA DAC Characteristics..................................................................................................................................................2-8

2.4 External Clock Chip............................................................................................................................................................2-8

Chapter 3: Pin Descriptions and Strap Options

3.1 Pin Assignment

...................................................................................................................................................................3-2

Proprietary

41977 AMD RS690 Databook 3.04

Table of Contents-1

3.2 Interface Block Diagram

.................................................................................................................................................... 3-4

3.3 CPU HyperTransport Interface

.......................................................................................................................................... 3-5

3.4 PCI Express® Interfaces

.................................................................................................................................................... 3-5

3.4.1

1 x 16 Lane Interface for External Graphics

....................................................................................................... 3-5

3.4.2

A-Link Express II to Southbridge........................................................................................................................

3-5

3.4.3

4 x 1 Lane Interface for General Purpose External Devices

.............................................................................. 3-6

3.4.4

Miscellaneous PCI Express® Signals

................................................................................................................. 3-6

3.5 Clock Interface

................................................................................................................................................................... 3-6

3.6 CRT and TV Interface........................................................................................................................................................

3-6

3.7 Integrated DVI/HDMI Interface.........................................................................................................................................

3-7

3.8 TMDS Interface Multiplexed on the PCI Express® Graphics Lanes (Not Applicable to the RS690C)

........................... 3-8

3.9 Power Management Pins

................................................................................................................................................... 3-9

3.10 Miscellaneous Pins...........................................................................................................................................................

3-9

3.11 Power Pins......................................................................................................................................................................

3-10

3.12 Ground Pins.....................................................................................................................................................................3-11

3.13 Debug Port Signals..........................................................................................................................................................3-11

3.14 Strapping Options..........................................................................................................................................................

3-12

Chapter 4: Timing Specifications

4.1 CPU HyperTransport Bus Timing......................................................................................................................................

4-1

4.2 HyperTransport Reference Clock Timing Parameters

....................................................................................................... 4-1

4.3 PCI Express® Differential Clock AC Specifications.........................................................................................................

4-1

4.4 OSCIN Timing

................................................................................................................................................................... 4-1

4.5 Power Rail Power Up Sequence.........................................................................................................................................

4-3

Chapter 5: Electrical Characteristics and Physical Data

5.1 Electrical Characteristics....................................................................................................................................................

5-1

5.1.1

Maximum and Minimum Ratings........................................................................................................................

5-1

5.1.2

DC Characteristics

............................................................................................................................................... 5-2

5.2 RS690 Thermal Characteristics..........................................................................................................................................

5-4

5.2.1

RS690 Thermal Limits

........................................................................................................................................ 5-4

5.2.2

Thermal Diode Characteristics

............................................................................................................................ 5-5

5.3 Package Information

.......................................................................................................................................................... 5-5

5.3.1

Physical Dimensions............................................................................................................................................

5-5

5.3.2

Pressure Specification..........................................................................................................................................

5-7

5.3.3

Board Solder Reflow Process Recommendations

............................................................................................... 5-8

Chapter 6: Power Management and ACPI

6.1 ACPI Power Management Implementation

....................................................................................................................... 6-1

6.2 Power Management for the Graphics Controller

............................................................................................................... 6-2

6.2.1

PCI Function Power States

.................................................................................................................................. 6-2

6.2.2

PCI Power Management Interface.......................................................................................................................

6-2

6.2.3

Capabilities List Data Structure in PCI Configuration Space

............................................................................. 6-2

6.2.4

.................................................................................................................................... 6-3

41977 AMD RS690 Databook 3.04

Table of Contents-2

Proprietary

6.2.5

6.2.6

6.2.7

Capability Identifier: Cap_ID (Offset = 0)...........................................................................................................6-4

Next Item Pointer

.................................................................................................................................................6-5

PMC - Power Management Capabilities (Offset = 2)

..........................................................................................6-5

Chapter 7: Testability

7.1 Test Capability Features......................................................................................................................................................7-1

7.2 Test Interface.......................................................................................................................................................................7-1

7.3 XOR Tree

............................................................................................................................................................................7-1

7.3.1

Brief Description of an XOR Tree

.......................................................................................................................7-1

7.3.2

Description of the XOR Tree for the RS690

........................................................................................................7-2

7.3.3

XOR Tree Activation

...........................................................................................................................................7-2

7.3.4

XOR Chain for the RS690....................................................................................................................................7-2

7.4 VOH/VOL Test...................................................................................................................................................................7-4

7.4.1

Brief Description of a VOH/VOL Tree................................................................................................................7-4

7.4.2

VOH/VOL Tree Activation..................................................................................................................................7-4

7.4.3

VOH/VOL Pin List...............................................................................................................................................7-5

Appendix A: Pin Listings

A.1 RS690 Pin List Sorted by Ball Reference

......................................................................................................................... 1-2

A.2 RS690 Pin List Sorted by Pin Name

................................................................................................................................. 1-6

Appendix B: Revision History

Proprietary

41977 AMD RS690 Databook 3.04

Table of Contents-3

215RQA6AVA12FG相似产品对比

	215RQA6AVA12FG	215CQA6AVA12FG	216MQA6AVA12FG	216LQA6AVA12FG	215NQA6AVA12FG
描述	Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465	Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465	Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465	Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465	Microprocessor, CMOS, PBGA465, 21 X 21 MM, LEAD FREE, FCBGA-465
是否Rohs认证	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	BGA
包装说明	BGA, BGA465(UNSPEC)	BGA, BGA465(UNSPEC)	BGA, BGA465(UNSPEC)	BGA, BGA465(UNSPEC)	BGA, BGA465(UNSPEC)
针数	465	465	465	465	465
Reach Compliance Code	compli	compli	compli	compli	compli
JESD-30 代码	S-PBGA-B465	S-PBGA-B465	S-PBGA-B465	S-PBGA-B465	S-PBGA-B465
端子数量	465	465	465	465	465
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA
封装等效代码	BGA465(UNSPEC)	BGA465(UNSPEC)	BGA465(UNSPEC)	BGA465(UNSPEC)	BGA465(UNSPEC)
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
电源	1.2,1.8,3.3 V	1.2,1.8,3.3 V	1.2,1.8,3.3 V	1.2,1.8,3.3 V	1.2,1.8,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Base Number Matches	1	1	1	1	1

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