Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Cypress(赛普拉斯) |
零件包装代码 | TSOP |
包装说明 | TSOP1-28 |
针数 | 28 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 70 ns |
其他特性 | AUTOMATIC POWER-DOWN |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 11.8 mm |
内存密度 | 262144 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 32768 words |
字数代码 | 32000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP1 |
封装等效代码 | TSSOP28,.53,22 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最小待机电流 | 1.4 V |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.55 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8 mm |
CY62256VL-70ZIT | CY62256V25L-100ZCT | CY62256V-70ZRIT | CY62256VL-70ZRCT | CY62256VLL-70ZRCT | CY62256VL-70SNIT | CY62256VL-70ZRIT | CY62256V-70ZRCT | |
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描述 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28 | Standard SRAM, 32KX8, 100ns, CMOS, PDSO28, TSOP1-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, REVERSE, TSOP1-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, REVERSE, TSOP1-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, REVERSE, TSOP1-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.450 INCH, SOIC-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, REVERSE, TSOP1-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, REVERSE, TSOP1-28 |
零件包装代码 | TSOP | TSOP | TSOP | TSOP | TSOP | SOIC | TSOP | TSOP |
包装说明 | TSOP1-28 | TSOP1, | TSOP1-R, | TSOP1-R, | TSOP1-R, | 0.450 INCH, SOIC-28 | TSOP1-R, | TSOP1-R, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | not_compliant | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 70 ns | 100 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
其他特性 | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
长度 | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 18.3896 mm | 11.8 mm | 11.8 mm |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP1 | TSOP1 | TSOP1-R | TSOP1-R | TSOP1-R | SOP | TSOP1-R | TSOP1-R |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 2.794 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V | 2.7 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.3 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 2.5 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.55 mm | 0.55 mm | 0.55 mm | 0.55 mm | 0.55 mm | 1.27 mm | 0.55 mm | 0.55 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 7.5057 mm | 8 mm | 8 mm |
厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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