FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, TQFP-64
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | TQFP-64 |
针数 | 64 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 10 ns |
最大时钟频率 (fCLK) | 66.7 MHz |
周期时间 | 15 ns |
JESD-30 代码 | S-PQFP-G64 |
JESD-609代码 | e0 |
长度 | 14 mm |
内存密度 | 294912 bit |
内存集成电路类型 | OTHER FIFO |
内存宽度 | 9 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 64 |
字数 | 32768 words |
字数代码 | 32000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32KX9 |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装等效代码 | QFP64,.66SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大待机电流 | 0.015 A |
最大压摆率 | 0.15 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
宽度 | 14 mm |
IDT72V271L15PF | IDT72V271L20TF | IDT72V261L20TF | IDT72V261L15PF | IDT72V261L15TF | IDT72V271L20PF | IDT72V261L20PF | IDT72V271L15TF | |
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描述 | FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, TQFP-64 | FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 | FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 | FIFO, 16KX9, 10ns, Synchronous, CMOS, PQFP64, TQFP-64 | FIFO, 16KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 | FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 | FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 | FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | TQFP-64 | STQFP-64 | STQFP-64 | TQFP-64 | STQFP-64 | TQFP-64 | TQFP-64 | STQFP-64 |
针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 10 ns | 12 ns | 12 ns | 10 ns | 10 ns | 12 ns | 12 ns | 10 ns |
最大时钟频率 (fCLK) | 66.7 MHz | 50 MHz | 50 MHz | 66.7 MHz | 66.7 MHz | 50 MHz | 50 MHz | 66.7 MHz |
周期时间 | 15 ns | 20 ns | 20 ns | 15 ns | 15 ns | 20 ns | 20 ns | 15 ns |
JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 14 mm | 10 mm | 10 mm | 14 mm | 10 mm | 14 mm | 14 mm | 10 mm |
内存密度 | 294912 bit | 294912 bit | 147456 bit | 147456 bit | 147456 bit | 294912 bit | 147456 bit | 294912 bi |
内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
字数 | 32768 words | 32768 words | 16384 words | 16384 words | 16384 words | 32768 words | 16384 words | 32768 words |
字数代码 | 32000 | 32000 | 16000 | 16000 | 16000 | 32000 | 16000 | 32000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 32KX9 | 32KX9 | 16KX9 | 16KX9 | 16KX9 | 32KX9 | 16KX9 | 32KX9 |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LFQFP | LFQFP | LQFP | LFQFP | LQFP | LQFP | LFQFP |
封装等效代码 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.66SQ,32 | QFP64,.47SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大待机电流 | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A |
最大压摆率 | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 14 mm | 10 mm | 10 mm | 14 mm | 10 mm | 14 mm | 14 mm | 10 mm |
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