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IDT54FCT827ADB

产品描述Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24
产品类别逻辑    逻辑   
文件大小78KB,共7页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT54FCT827ADB概述

Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24

IDT54FCT827ADB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码DIP
包装说明DIP, DIP24,.3
针数24
Reach Compliance Codenot_compliant
其他特性WITH OUTPUT ENABLE
控制类型ENABLE LOW
系列FCT
JESD-30 代码R-GDIP-T24
JESD-609代码e0
长度32.004 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.032 A
位数10
功能数量1
端口数量2
端子数量24
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性TRUE
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装等效代码DIP24,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)225
电源5 V
Prop。Delay @ Nom-Sup9 ns
传播延迟(tpd)17 ns
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间20
宽度7.62 mm

文档预览

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IDT54/74FCT827A/B
HIGH-PERFORMANCECMOSBUFFER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
HIGH-PERFORMANCE
CMOS BUFFER
IDT54/74FCT827A/B
• Faster than AMD's Am29827 series
• Equivalent to AMD's Am29827bipolar buffers in pinout/function,
speed, and output drive over full temperature and voltage
supply extremes
• IDT54/74FCT827A equivalent to FAST™ speed
• IDT54FCT827B 35% faster than FAST
• I
OL
= 48mA (commercial) and 32mA (military)
• Clamp diodes on all inputs for ringing suppression
• CMOS power levels (1mW typ. static)
• TTL input and output level compatible
• CMOS output level compatible
• Substantially lower input current levels than AMD's bilopar
Am29800 series (5µA max.)
µ
• MIlitary product compliant to MIL-STD-883, Class B
• Available in the following packages:
– Commercial: SOIC
– Military: CERDIP, LCC
FEATURES:
DESCRIPTION:
The IDT54/74FCT800 series is built using an advanced dual metal
CMOS technology.
The IDT54/74FCT827 10-bit bus drivers provide high-performance bus
interface buffering for wide data/address paths or buses carrying parity. The
10-bit buffers have NAND-ed output enables for maximum control flexibility.
All of the IDT54/74FCT800 high-performance interface family are de-
signed for high-capacitance load drive capability, while providing low-
capacitance bus loading at both inputs and outputs. All inputs have clamp
diodes and all outputs are designed for low-capacitance bus loading in high-
impedance state.
FUNCTIONAL BLOCK DIAGRAM
Y
0
Y
1
Y
2
Y
3
Y
4
Y
5
Y
6
Y
7
Y
8
Y
9
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
OE
1
OE
2
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES
1
OCTOBER 2002
DSC-4612/5
© 2002 Integrated Device Technology, Inc.

IDT54FCT827ADB相似产品对比

IDT54FCT827ADB IDT74FCT827ASO IDT54FCT827BDB
描述 Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24 Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, SOIC-24 Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24
是否Rohs认证 不符合 不符合 不符合
零件包装代码 DIP SOIC DIP
包装说明 DIP, DIP24,.3 SOP, SOP24,.4 DIP, DIP24,.3
针数 24 24 24
Reach Compliance Code not_compliant not_compliant _compli
其他特性 WITH OUTPUT ENABLE WITH OUTPUT ENABLE WITH OUTPUT ENABLE
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW
系列 FCT FCT FCT
JESD-30 代码 R-GDIP-T24 R-PDSO-G24 R-GDIP-T24
JESD-609代码 e0 e0 e0
长度 32.004 mm 15.4 mm 32.004 mm
负载电容(CL) 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.032 A 0.048 A 0.032 A
位数 10 10 10
功能数量 1 1 1
端口数量 2 2 2
端子数量 24 24 24
最高工作温度 125 °C 70 °C 125 °C
最低工作温度 -55 °C - -55 °C
输出特性 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE
封装主体材料 CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED
封装代码 DIP SOP DIP
封装等效代码 DIP24,.3 SOP24,.4 DIP24,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE IN-LINE
峰值回流温度(摄氏度) 225 225 225
电源 5 V 5 V 5 V
传播延迟(tpd) 17 ns 15 ns 14 ns
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 2.65 mm 5.08 mm
最大供电电压 (Vsup) 5.5 V 5.25 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.75 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 NO YES NO
技术 CMOS CMOS CMOS
温度等级 MILITARY COMMERCIAL MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 20 30 20
宽度 7.62 mm 7.5 mm 7.62 mm
厂商名称 IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
Prop。Delay @ Nom-Sup 9 ns 8 ns -
筛选级别 MIL-STD-883 Class B - MIL-STD-883 Class B

 
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