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MB9DF564LGEEQ-GTE1

产品描述RISC Microcontroller, CMOS
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小2MB,共91页
制造商Cypress(赛普拉斯)
标准
下载文档 详细参数 选型对比 全文预览 文档解析

MB9DF564LGEEQ-GTE1概述

RISC Microcontroller, CMOS

MB9DF564LGEEQ-GTE1规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Cypress(赛普拉斯)
Reach Compliance Codecompliant
具有ADCYES
地址总线宽度
位大小32
最大时钟频率48 MHz
DAC 通道YES
DMA 通道YES
外部数据总线宽度
长度24 mm
I/O 线路数量124
端子数量176
PWM 通道YES
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
速度200 MHz
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
端子形式GULLWING
端子节距0.5 mm
端子位置QUAD
宽度24 mm
uPs/uCs/外围集成电路类型MICROCONTROLLER, RISC

文档解析

MB9D560系列是Cypress Semiconductor公司推出的32位微控制器,属于Traveo™家族,专为汽车电机控制应用设计。该产品基于ARM Cortex-R5 MPCore CPU,采用90nm CMOS技术,支持ARMv7和Thumb-2指令集,最高工作频率可达200MHz。核心特性包括双指令发放架构、8级流水线、双精度浮点单元(FPU)和内存保护单元(MPU),提供16个保护区域。此外,该系列支持ECC(单错纠正/双错检测)技术,确保数据完整性。产品设计符合汽车行业标准,适用于高可靠性要求的动力系统控制场景。 关键功能包括时钟控制系统,内置快速CR振荡器(8MHz)和慢速CR振荡器(100kHz),支持外部主时钟输入和PLL倍频。复位控制模块涵盖硬件和软件复位机制,复位因素包括电源复位、外部复位、看门狗复位等。低功耗管理支持运行状态(RUN)和节能状态(PSS),可独立配置时钟源和分频器。内存子系统包括主Flash存储器(连接ATCM端口)、工作Flash和主SRAM(连接BTCM端口),均提供ECC保护和并行编程能力。调试接口采用JTAG(5针),支持ARM CoreSight技术,集成ETM-R5跟踪单元,并配备128位安全密钥以增强调试安全性。 该系列外设丰富,包含16通道DMA控制器、中断控制器(支持512个IRQ和32个NMI通道)、外部中断输入以及进程间通信单元(IPCU)。定时器资源包括24位TPU定时器、16位和32位自由运行定时器、输入捕获和输出比较模块。模拟接口集成12位ADC(32通道)和4通道采样保持ADC,转换时间低至1μs。通信接口支持多串行接口(UART/CSIO/LIN)、CAN(3通道,符合2.0A/B标准)和FlexRay控制器(符合v2.1协议)。此外,产品提供R/D转换器、DAC和电机矢量加速器(MVA),优化了电机控制算法的执行效率。

MB9DF564LGEEQ-GTE1文档预览

MB9D560 Series
32-bit Microcontroller
Traveo
TM
Family
MB9D560 series has Cypress 32-bit microcontrollers for automobile motor control. They use the ARM
®
Cortex-R5 MPCore
TM
CPU
that is compatible with the ARM family.
Notes:
• ARM, Cortex, Thumb are the registered trademarks of ARM Limited in the EU and other countries.
• MPCore, CoreSight are the trademarks of ARM Limited in the EU and other countries.
Features
Technology
CMOS 90nm technology
CPU
ARM Cortex
®
-R5F
32-bit ARM architecture
2-instruction issuance super scalar
8-stage pipeline
ARMv7 / Thumb
®
-2 instruction set
Floating-Point Unit (FPU)
Double
Debugging
ARM CoreSight
TM
Technology
Each
CPU embedded Embedded Trace Macro (ETM),
trace support of CPU operation
Debugging interface
(5 pin )
Support clock : maximum 20 MHz
JTAG
Debugging security support
128-bit
security key (Device security key)
Wakeup function on JTAG
Operation mode
User mode
Normal
precision
Memory protection Unit (MPU)
16
area
error correction, 2-bit error detection ECC (SEC-DED)
mode (internal memory activation)
ECC support for the TCM port
1-bit
Serial writer mode
Clock control
Internal clock source
Fast-CR
Slow-CR
TCM port
2
TCM ports
ATCM port
BTCM 2 ports (B0TCM, B1TCM)
VIC port
Low
oscillation (8 MHz)
oscillation (100 kHz)
External oscillation input
Main
clock input
PLL (Multiplying clock of main oscillation )
latency interrupt
Embedded PLL
Main
AXI master interface
interface (instruction / data access)
32-bit AXI interface (I/O access)
64-bit AXI
Oscillator stabilized timer
oscillator stabilized timer for all clock source
independently
After a lapse of oscillator stabilized time, it is able to use
source clock timer (Except PLL for FlexRay/RDC)
Support
AXI slave interface
64-bit AXI
interface (accessible to TCM port)
CPU configuration
2
CPUs (AMP operation)
200 MHz
Operating frequency
Maximum
Trace with ETM-R5
Cypress Semiconductor Corporation
Document Number: 002-05679 Rev.*A
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised March 22, 2016
MB9D560 Series
Reset control
Reset level
Hardware
Watchdog timer (WDT)
Watchdog timer embedded
Hardware
reset (system initialization)
Software reset (programing initialization)
watchdog timer
Software watchdog timer
Reset factor (Hardware reset )
Power-on
Hardware watchdog timer
unit per system
32-bit watchdog timer with window function
Clock source: fast-CR or slow-CR
Set by boot program (BootROM maker)
Not set by user program
1
reset (PONR), external reset input (RSTX,
NMIX+RSTX), clock stop waiting with time-out reset,
low-voltage detection reset (internal low-voltage detection
reset, 5V external low-voltage detection reset ), watchdog
reset (hardware watchdog reset, software watchdog reset ),
clock supervisor reset (main clock monitor, PLL clock
monitor), software trigger hardware reset , profile error
reset
reset
Software watchdog timer
unit per CPU
32-bit watchdog timer with window function
Clock source: fast-CR, slow-CR, main clock
One time set on user program (not set again)
1
Reset factor (software reset )
Software
Low power consumption control
Device state
RUN
Low-voltage detection (LVD)
Select voltage monitor
low-voltage detection (5V power line monitor):
3.9V, 4.1V, 4.3V
Internal low-voltage detection (1.2V power line monitor):
0.9V
External
(Run State, CPU is operation status)
PSS (Power Saving State, CPU wait event from WFI)
Setting parameter of each devise state
Clock
(clock source enable, clock source selection, clock
divider, clock domain enable)
Clock monitor
Low-voltage detection
Internal low-voltage detection: always valid
External low-voltage detection: valid/invalid set
External low-voltage detection: set threshold voltage
independently on RUN / PSS
Memory protection unit (MPU)
Memory protection as master except processor
Target master
DMA controller
Output when low-voltage detection
External
Internal
low-voltage detection: reset or NMI
low-voltage detection: reset
8 area
NMI generation when violation detection
Timing protection unit (TPU)
TPU 1 unit as CPU 1 unit
24-bit timer x 8 channels per unit
Support execution time protection, locking time protection,
inter-arrival time protection, deadline protection
Main Flash memory (TCFLASH)
Cortex-R5F ATCM connection
1
Main Flash memory as CPU 1 unit
HPM connection with 64-bit AXI
Flash memory configuration
Interleave
with 64-bit Flash 2 units
2 address areas
(read only)
AXI (read / write)
TCM
Support normal mode and over flow mode
Prescaler of each channels
Timer
clock divider (1/1 to 1/64)
clock divider (1/1, 1/2, 1/4, 1/16)
ECC support (SEC-DED)
Parallel programming support
Flash security
Work Flash memory (WorkFLASH)
2 Work Flash memories
1
Independent prescaler of each channels
Timer
Clock supervisor (CSV)
Monitor target clock
Main
oscillation input , main PLL output
of frequency range
Work Flash memory as CPU 1 unit
Monitor method
Monitor
ECC support (SEC-DED)
Parallel programming support
Flash security
Page 2 of 91
Operation after error detection
Reset
or NMI
Document Number: 002-05679 Rev.*A
MB9D560 Series
Main SRAM (TCRAM)
BTCM connection of Cortex-R5F
main SRAM as CPU 1 unit
Interleave with 2 ports of B0TCM and B1TCM
1
Exclusion access memory (EAM)
Small size memory to support exclusion control on exclusion
access instruction
Use for semaphore
Size: 48 byte
Bit-band unit (BBU)
The bit operation of specified register bit on Bit band area, it
is mapping 1 bit of bit band area to support bit band alias
area for 1 byte. The target of bit band access is specified
register bit on I/O area
ECC support (SEC-DED)
BootROM
Size: 16K byte
Boot operation support
Serial writer program support
DMA controller (DMAC)
16 channels
Transfer mode
Block
CRC
Output to register of CRC code according real time writing to
input register
transfer, Burst transfer
increment
Dynamic, Round robin
Addressing mode
Fixed,
Base timer
16-bit timer
of four PWM/PPG/reload/PWC timer functions can be
selected and used.
A 32-bit timer can be used in 2 channels of cascade mode
as reload/PWC timer.
Any
Priority between channels
Fixed,
Interrupt control (IRC)
Support normal interrupt (IRQ) and non-maskable interrupt
(NMI)
16-bit free-run timer (FRT)
16 bit up/down counter (2 channels for motor control only)
32-bit free-run timer
32 bit up/down counter
16-bit input capture (ICU)
Input capture
16-bit
Normal interrupt (IRQ)
Use
Interrupt Request (IRQ) of Cortex-R5F
512 channels
32 level for priority
Support low latency interrupt response from VIC port of
Cortex-R5F
Non-maskable interrupt (NMI)
fast interrupt request (FIQ) of Cortex-R5F
32 channels
16 level for priority
Use
Support software interrupt generation
External interrupt (EXT-IRQ)
Input
interrupt (IRQ): 8 input
Non-maskable interrupt (NMI): 1 input
Normal
capture register that detects rise edge, Fall edge,
both edge
Generate interrupt request after latch of counter number of
16 bit
Free-run timer with edge detection of pin input
32-bit input capture
Input capture
capture register that detects rise edge, fall edge,
both edge
Generate interrupt request after latch of counter number of
32 bit
Free-run timer with edge detection of pin input
32-bit
Detection method
H
level , L level , rise edge, fall edge, both edge
LIN sync break/sync field relation is following.
capture ch.0
Multi-function serial interface ch.0
Input capture ch.1
Multi-function serial interface ch.1
Input capture ch.2
Multi-function serial interface ch.2
Input capture ch.3
Multi-function serial interface ch.3
Input capture ch.4
Multi-function serial interface ch.4
Input
Inter-processor communications unit (IPCU)
Mailbox function
communication for CPU core communication by 8
Mailbox
Support of interrupt between CPU core
Data
16-bit output compare (OCU)
Output interrupt signal when compare with 16-bit free-run
timer
Document Number: 002-05679 Rev.*A
Page 3 of 91
MB9D560 Series
Waveform generator (WFG)
Generate variable output
time output
16-bit PPG waveform output
PPG uses 16-bit PPG timer of base timer
The relation is following
WFG(ch.0 to ch.5)
• Base timer ch.0
PPG0
• Base timer ch.2
PPG2
• Base timer ch.4
PPG4
WFG(ch.6 to ch.11)
• Base timer ch.6
PPG6
• Base timer ch.8
PPG8
• Base timer ch.10
PPG10
Non overlap three-phase waveform output (inverter
control)
DC chopper waveform output
Real
CAN interface
The CAN is based on the CAN protocol ver. 2.0A/B
64 message buffers x 3 channels
An identification mask is applied to each message object
Up to 1Mbps support
Clock support CAN prescaler
CAN wakeup functions
FlexRay controller
Supports FlexRay protocol specification v2.1
Maximum 128 message buffers
8K Byte message RAM
Variable length of message buffers
Each message buffer can be allocated as a part of reception
buffer, transmission buffer or reception FIFO
Dead time timer function
GATE function
DTTI function
A/D converter (ADC)
12-bit resolution A/D converter: 1 unit (32 channels)
Sampling analog value from input port of 32 channels
Conversion time: 1
s
External trigger activation (ADTG)
Activation from internal timer (base timer)
4ch sample-hold A/D converter
12 bit resolution A/D converter: 2 units (8 channels )
Multi-function serial interface (MFS)
UART / CSIO / LIN interface (v2.1) communication available
by selecting the function
Host access to the message buffer via input and output
buffers
Filtering for slot counter, cycle counter and channels
Maskable interrupts are supported
R/D converter (RDC)
Connect to resolver interface
D/A converter (DAC)
10-bit resolution
Motor vector operation accelerator (MVA)
Assist for three-phase current normalizing, three-phase to
two-phase DC conversion / two-phase to three- phase AC
conversion, angler calculation, PID control calculation.
Error detection in processing (overflow/under flow/non
normalizing error of FLOP)
Transmission FIFO: 64 Byte, reception FIFO: 64 Byte
Reception interrupt factor (3 types)
error detection (parity, over run, frame error)
Reception to FIFO for data of setting value
Reception data under setting value in FIFO, idle term
detection of over 8 clocks with baud rate clock
Reception
Amplitude diagnosis /angle diagnosis function of R/D
converter
Error current diagnosis function
Key code
Key code supports
of General-purpose I/O (GPIO) register
Port pin configuration (PPC) register
Analog input control register (ADER)
4ch ADC analog input control register (ADER4CH_1,
ADER4CH_0)
Analog output control register (DAC00_DAER,
DAC01_DAER)
A part
Transmission interrupt factor (2 types)
transmission operation
Transmission FIFO empty (contain transmission operation)
No
SPI (serial peripheral interface) support
LIN protocol revision 2.1 support
Up/Down counter (UDC)
8/16-bit up/down counter (2 channels uses for R/D converter)
Document Number: 002-05679 Rev.*A
Page 4 of 91
MB9D560 Series
Contents
1. Product Lineup .................................................................................................................................................................. 6
2. Pin Assignment ................................................................................................................................................................. 7
3. Pin Description ................................................................................................................................................................ 11
4. I/O Circuit Type ............................................................................................................................................................... 25
5. Handling Precautions ..................................................................................................................................................... 28
5.1
Precautions for Product Design ................................................................................................................................... 28
5.2
Precautions for Package Mounting .............................................................................................................................. 29
5.3
Precautions for Use Environment ................................................................................................................................ 30
6. Handling Devices ............................................................................................................................................................ 31
7. Block Diagram ................................................................................................................................................................. 33
8. Memory Map .................................................................................................................................................................... 35
9. I/O Map ............................................................................................................................................................................. 38
10. Pin Statuses in CPU Status ............................................................................................................................................ 42
11. Electrical Characteristics ............................................................................................................................................... 44
11.1 Absolute Maximum Ratings ......................................................................................................................................... 44
11.2 Recommended Operating Conditions ......................................................................................................................... 46
11.3 DC Characteristics ...................................................................................................................................................... 47
11.4 AC Characteristics ....................................................................................................................................................... 54
11.4.1 Source Clock Timing .................................................................................................................................................... 54
11.4.2 Internal Clock Timing ................................................................................................................................................... 55
11.4.3 Reset Input ................................................................................................................................................................... 58
11.4.4 Power-on Conditions .................................................................................................................................................... 59
11.4.5 Multi-Function Serial Interface ..................................................................................................................................... 60
11.4.6 Timer Input Timing ....................................................................................................................................................... 77
11.4.7 Trigger Input Timing ..................................................................................................................................................... 78
11.4.8 NMI Input Timing .......................................................................................................................................................... 79
11.4.9 External Low-Voltage Detection ................................................................................................................................... 80
11.4.10 Internal Low-Voltage Detection................................................................................................................................. 80
11.5 A/D Converter .............................................................................................................................................................. 81
11.5.1 Electrical Characteristics .............................................................................................................................................. 81
11.5.2 Notes on Using A/D Converter ..................................................................................................................................... 81
11.6 4 Channels Same Time Sampling A/D Converter ....................................................................................................... 82
11.6.1 Electrical Characteristics .............................................................................................................................................. 82
11.6.2 Notes on Using A/D converter ...................................................................................................................................... 82
11.6.3 Definition of Terms ....................................................................................................................................................... 83
11.7 Flash Memory .............................................................................................................................................................. 84
11.8 R/D Converter ............................................................................................................................................................. 85
12. Ordering Information ...................................................................................................................................................... 86
13. Part Number Option ........................................................................................................................................................ 86
14. Package Dimensions ...................................................................................................................................................... 87
15. Major Changes ................................................................................................................................................................ 89
Document History ................................................................................................................................................................. 90
Document Number: 002-05679 Rev.*A
Page 5 of 91

MB9DF564LGEEQ-GTE1相似产品对比

MB9DF564LGEEQ-GTE1 MB9DF564LQEEQ-GTE1 MB9DF564MAEEQ-GTE1 MB9DF565LAEEQ-GTE1 MB9DF565LGEEQ-GTE1 MB9DF565LQEEQ-GTE1 MB9DF565MAEEQ-GTE1 MB9DF565MQEEQ-GTE1 MB9DF566LQEEQ-GTE1
描述 RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS RISC Microcontroller, CMOS
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
具有ADC YES YES YES YES YES YES YES YES YES
位大小 32 32 32 32 32 32 32 32 32
最大时钟频率 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
DAC 通道 YES YES YES YES YES YES YES YES YES
DMA 通道 YES YES YES YES YES YES YES YES YES
长度 24 mm 24 mm 28 mm 24 mm 24 mm 24 mm 28 mm 28 mm 24 mm
I/O 线路数量 124 124 149 124 124 124 149 149 124
端子数量 176 176 208 176 176 176 208 208 176
PWM 通道 YES YES YES YES YES YES YES YES YES
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
速度 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 GULLWING GULLWING GULLWING GULLWING GULLWING GULLWING GULLWING GULLWING GULLWING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
宽度 24 mm 24 mm 28 mm 24 mm 24 mm 24 mm 28 mm 28 mm 24 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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