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Datasheet> 器件分类 > 存储> 存储> MT45W4MW16BFB-706LWT

MT45W4MW16BFB-706LWT: 产品描述Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54; 产品类别存储存储; 文件大小899KB，共61页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/

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MT45W4MW16BFB-706LWT概述

Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54

MT45W4MW16BFB-706LWT规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54
针数	54
Reach Compliance Code	not_compliant
ECCN代码	3A991.B.2.A
最长访问时间	70 ns
其他特性	SYNCHRONOUS BURST MODE POSSIBLE
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B54
JESD-609代码	e0
长度	8 mm
内存密度	67108864 bit
内存集成电路类型	PSEUDO STATIC RAM
内存宽度	16
功能数量	1
端子数量	54
字数	4194304 words
字数代码	4000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-30 °C
组织	4MX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装等效代码	BGA54,6X9,30
封装形状	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	235
电源	1.8,1.8/3 V
认证状态	Not Qualified
座面最大高度	1 mm
最大待机电流	0.0001 A
最大压摆率	0.03 mA
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	6 mm

MT45W4MW16BFB-706LWT相似产品对比

	MT45W4MW16BFB-706LWT	MT45W4MW16BBB-706WT	MT45W4MW16BFB-856WT	MT45W4MW16BFB-706WT	MT45W4MW16BBB-708WT	MT45W4MW16BBB-706LWT	MT45W4MW16BFB-708LWT	MT45W4MW16BFB-708WT
描述	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, LEAD FREE, VFBGA-54	Pseudo Static RAM, 4MX16, 85ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, LEAD FREE, VFBGA-54	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, LEAD FREE, VFBGA-54	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54
是否Rohs认证	不符合	符合	不符合	不符合	符合	符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	VFBGA, BGA54,6X9,30	6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	VFBGA, BGA54,6X9,30	VFBGA, BGA54,6X9,30	6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54	6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54
针数	54	54	54	54	54	54	54	54
Reach Compliance Code	not_compliant	unknown	not_compliant	unknown	unknown	unknown	not_compliant	not_compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	70 ns	70 ns	85 ns	70 ns	70 ns	70 ns	70 ns	70 ns
其他特性	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE	SYNCHRONOUS BURST MODE POSSIBLE
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54
JESD-609代码	e0	e1	e0	e0	e1	e1	e0	e0
长度	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
内存密度	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
内存集成电路类型	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM
内存宽度	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1
端子数量	54	54	54	54	54	54	54	54
字数	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
组织	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
封装等效代码	BGA54,6X9,30	BGA54,6X9,30	BGA54,6X9,30	BGA54,6X9,30	BGA54,6X9,30	BGA54,6X9,30	BGA54,6X9,30	BGA54,6X9,30
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	235	260	235	235	260	260	235	235
电源	1.8,1.8/3 V	1.8,1.8/3 V	1.8,1.8/3 V	1.8,1.8/3 V	1.8,1.8/3 V	1.8,1.8/3 V	1.8,1.8/3 V	1.8,1.8/3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
最大待机电流	0.0001 A	0.00012 A	0.00012 A	0.00012 A	0.00012 A	0.0001 A	0.0001 A	0.00012 A
最大压摆率	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.035 mA	0.03 mA	0.035 mA	0.035 mA
最大供电电压 (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子面层	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30
宽度	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm
厂商名称	Micron Technology	Micron Technology	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology

MT45W4MW16BFB-706LWT

MT45W4MW16BFB-706LWT概述

MT45W4MW16BFB-706LWT规格参数

MT45W4MW16BFB-706LWT相似产品对比

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