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Datasheet> 器件分类 > 无源元件> 电容器> 060321002P20BCB
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060321002P20BCB

产品描述Ceramic Capacitor, Multilayer, Ceramic, 100V, 4.55% +Tol, 4.55% -Tol, C0G, 30ppm/Cel TC, 0.0000022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小197KB，共2页
制造商Syfer
标准
相似器件已查找到20个与060321002P20BCB功能相似器件
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060321002P20BCB概述

Ceramic Capacitor, Multilayer, Ceramic, 100V, 4.55% +Tol, 4.55% -Tol, C0G, 30ppm/Cel TC, 0.0000022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

060321002P20BCB规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明, 0603
Reach Compliance Codecompli
ECCN代码EAR99
电容0.0000022 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号0603
安装特点SURFACE MOUNT
多层Yes
负容差4.55%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法BULK
正容差4.55%
额定（直流）电压（URdc）100 V
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Matte Tin (Sn)
端子形状WRAPAROUND
Base Number Matches1

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MLCCs
for Non-
magnetic
applications
C0G/NP0, High Q and X7R
Copper Barrier MLCCs
Multilayer ceramic capacitors
with silver/palladium (Ag/Pd)
terminations have often been
used in medical applications
where non-magnetic
components are required, for
example in MRI equipment.
The use of conventional nickel
barrier terminations is not
suitable due to nickel exhibiting
magnetic properties.
However, RoHS requirements
have dictated the use of
lead-free solders, and the
composition of these solders
has resulted in an increase in
soldering temperatures. This
has caused solder leaching
problems for the Ag/Pd
termination, and meant
alternative terminations have
had to be found.
Specification
Capacitance Values
C0G/NP0 & High Q
0.1pF - 15nF
X7R
47pF - 6.8µF
See overleaf for full list of values
Mechanical
Termination Material
See ordering information below
Solderability
IEC 60068-2-58. Passed 3 times reflow
profile defined in J-STD-020
Printing
Consult sales office
Lead Free Soldering
Termination codes 2 and 3 ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible with lead
free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance tables overleaf
Electrical
C0G/NP0
-55°C to
+125°C
High Q
-55°C to
+125°C
X7R
-55°C to
+125°C
Operating Temperature
Temperature Coefficient
(Typical)
0 ± 30
ppm/°C
0 ± 30
ppm/°C
±15%
Insulation Resistance
Time constant (Ri xCr) (whichever is the least)
100GΩ or
1000s
Ageing Rate
None
None
Typical 1% per
time decade
100GΩ or
1000s
100GΩ or
1000s
Ordering Information
1210
Chip
size
0402
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
3
Termination
2
(for C0G/NP0
& High Q only)
= Sintered
silver base with
copper barrier
(100% matte tin
plating). RoHS
compliant.
100
Voltage
0103
Capacitance in
picofarads (pF)
J
Capacitance
tolerance
X
Dielectric
T
Packaging
___
Suffix
As copper is non-magnetic,
one solution is to use a copper
barrier instead of a nickel
barrier, with a tin finish on top,
and this is the solution Syfer
has developed.
This copper barrier termination
is offered with selected non-
magnetic C0G/NP0, High Q
and X7R dielectrics, providing a
fully non-magnetic component.
To meet high temperature
260ºC soldering reflow profiles
as detailed in J-STD-020, C0G/
NP0 dielectrics are supplied
with sintered termination and
X7R dielectrics are supplied
with Syfer’s award winning
FlexiCap™ termination.
41/09
016 = 16V <10pF Insert a P for
C
= C0G/
T
= 178mm Used for
<4.7pF
the decimal point, H = ±0.05pF NP0 (1B)
025 = 25V
(7”) reel
specific
050 = 50V
eg P300 = 0.3pF,
customer
B = ±0.1pF
X
= X7R
R
= 330mm
8P20 = 8.2pF.
063 = 63V
C = ±0.25pF
(2R1)
(13”) reel requirements
100 = 100V
D = ±0.5pF
10pF 1st digit
Q
= High Q
B
= Bulk
150 = 150V
is 0. 2nd and
4.7pF &
pack - tubs
200 = 200V
3rd digits are
<10pF
250 = 250V significant figures
B = ±0.1pF
3
= FlexiCap™ 500 = 500V
of capacitance
C = ±0.25pF
630 = 630V code. The 4th digit D = ±0.5pF
base with
1K0 = 1000V is number of 0’s
copper barrier
10pF
(100% matte 1K2 = 1200V
following
F = ±1%
1K5 = 1500V
tin plating).
eg. 0103 =
G = ±2%
RoHS compliant. 2K0 = 2000V
10000pF
J = ±5%
3K0 = 3000V
K = ±10%
Values <1pF in
0.1pF steps, above
this values are E24
series

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