IC DUAL OP-AMP, 15000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, LEAD FREE, MS-012AA, SOIC-8, Operational Amplifier
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | SOIC |
包装说明 | LEAD FREE, MS-012AA, SOIC-8 |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.0001 µA |
标称共模抑制比 | 86 dB |
最大输入失调电压 | 15000 µV |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.9 mm |
湿度敏感等级 | 1 |
负供电电压上限 | -18 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 2 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
标称压摆率 | 20 V/us |
供电电压上限 | 18 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
标称均一增益带宽 | 6000 kHz |
宽度 | 3.9 mm |
ADTL082RZ-REEL | ADTL082ARUZ | ADTL082ARUZ-REEL | ADTL082R | ADTL082R-REEL | ADTL082RZ-REEL7 | |
---|---|---|---|---|---|---|
描述 | IC DUAL OP-AMP, 15000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, LEAD FREE, MS-012AA, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, LEAD FREE, MO-187AA, MSOP-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, LEAD FREE, MO-187AA, MSOP-8, Operational Amplifier | IC DUAL OP-AMP, 15000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, MS-012AA, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 15000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, MS-012AA, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 15000 uV OFFSET-MAX, 6 MHz BAND WIDTH, PDSO8, LEAD FREE, MS-012AA, SOIC-8, Operational Amplifier |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | SOIC | TSSOP | TSSOP | SOIC | SOIC | SOIC |
包装说明 | LEAD FREE, MS-012AA, SOIC-8 | TSSOP, | TSSOP, | SOP, | SOP, | LEAD FREE, MS-012AA, SOIC-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.0001 µA | 0.00055 µA | 0.00055 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA |
标称共模抑制比 | 86 dB | 86 dB | 86 dB | 86 dB | 86 dB | 86 dB |
最大输入失调电压 | 15000 µV | 9000 µV | 9000 µV | 15000 µV | 15000 µV | 15000 µV |
JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 4.9 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 4.9 mm |
负供电电压上限 | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSSOP | TSSOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm | 1.75 mm | 1.75 mm |
标称压摆率 | 20 V/us | 20 V/us | 20 V/us | 20 V/us | 20 V/us | 20 V/us |
供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
标称均一增益带宽 | 6000 kHz | 6000 kHz | 6000 kHz | 6000 kHz | 6000 kHz | 6000 kHz |
宽度 | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm | 3.9 mm |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | - | - | 符合 |
JESD-609代码 | e3 | e3 | e3 | - | - | e3 |
峰值回流温度(摄氏度) | 260 | 260 | 260 | - | - | 260 |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - | Matte Tin (Sn) |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | - | - | 40 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved