High Performance General Purpose Blackfin Processor
参数名称 | 属性值 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | BGA |
包装说明 | BGA, BGA169,17X17,40 |
针数 | 169 |
制造商包装代码 | B-169 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.A.2 |
其他特性 | ALSO REQUIRES 3V OR 3.3V SUPPLY |
地址总线宽度 | 19 |
桶式移位器 | YES |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 40 MHz |
外部数据总线宽度 | 16 |
格式 | FIXED POINT |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-PBGA-B169 |
JESD-609代码 | e0 |
长度 | 19 mm |
低功率模式 | YES |
湿度敏感等级 | 3 |
端子数量 | 169 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA169,17X17,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 225 |
电源 | 1.2,2.5/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 2.5 mm |
速度 | 500 MHz |
最大供电电压 | 1.45 V |
最小供电电压 | 0.8 V |
标称供电电压 | 1.2 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 19 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
ADSP-BF533SBB500 | ADSP-BF533SKBC-600 | ADSP-BF533SKBC600X | ADSP-BF533SKBC750X | ADSP-BF533SKSTZ-5V | ADSP-BF533WBBCZ-5A | ADSP-BF533WYBCZ-4A | ADSP-BF533WBBZ-5A | ADSP-BF533SKBCZ600 | |
---|---|---|---|---|---|---|---|---|---|
描述 | High Performance General Purpose Blackfin Processor | IC 16-BIT, 33.33 MHz, OTHER DSP, PBGA160, PLASTIC, MO-025AE, BGA-160, Digital Signal Processor | IC 16-BIT, 33.33 MHz, OTHER DSP, PBGA160, PLASTIC, MO-025AE, BGA-160, Digital Signal Processor | IC 16-BIT, 40 MHz, OTHER DSP, PBGA160, 12 X 12 MM, 1.70 MM HEIGHT, MO-205AE, CSPBGA-160, Digital Signal Processor | High Performance General Purpose Blackfin Processor | IC 16-BIT, 40 MHz, OTHER DSP, PBGA160, 12 X 12 MM, 1.70 MM HEIGHT, ROHS COMPLIANT, MO-205AE, CSPBGA-160, Digital Signal Processor | IC 16-BIT, 40 MHz, OTHER DSP, PBGA160, 12 X 12 MM, 1.70 MM HEIGHT, ROHS COMPLIANT, MO-205AE, CSPBGA-160, Digital Signal Processor | IC 16-BIT, 40 MHz, OTHER DSP, PBGA169, ROHS COMPLIANT, PLASTIC, MS-034AAG-2, BGA-169, Digital Signal Processor | IC 16-BIT, 50 MHz, OTHER DSP, PBGA160, LEAD FREE, MO-205AE, CSBGA-160, Digital Signal Processor |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | BGA | BGA | BGA | BGA | QFP | BGA | BGA | BGA | BGA |
包装说明 | BGA, BGA169,17X17,40 | LFBGA, | LFBGA, | LFBGA, BGA160,14X14,32 | LFQFP, QFP176,1.0SQ,20 | 12 X 12 MM, 1.70 MM HEIGHT, ROHS COMPLIANT, MO-205AE, CSPBGA-160 | 12 X 12 MM, 1.70 MM HEIGHT, ROHS COMPLIANT, MO-205AE, CSPBGA-160 | ROHS COMPLIANT, PLASTIC, MS-034AAG-2, BGA-169 | LFBGA, BGA160,14X14,32 |
针数 | 169 | 160 | 160 | 160 | 176 | 160 | 160 | 169 | 160 |
Reach Compliance Code | unknown | compliant | compliant | unknown | compliant | unknown | unknown | unknown | compliant |
地址总线宽度 | 19 | 20 | 20 | 20 | 19 | 20 | 20 | 20 | 20 |
桶式移位器 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 40 MHz | 33.33 MHz | 33.33 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 50 MHz |
外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-PBGA-B169 | S-PBGA-B160 | S-PBGA-B160 | S-PBGA-B160 | S-PQFP-G176 | S-PBGA-B160 | S-PBGA-B160 | S-PBGA-B169 | S-PBGA-B160 |
JESD-609代码 | e0 | e0 | e0 | e0 | e3 | e1 | e1 | e1 | e1 |
长度 | 19 mm | 12 mm | 12 mm | 12 mm | 24 mm | 12 mm | 12 mm | 19 mm | 12 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
端子数量 | 169 | 160 | 160 | 160 | 176 | 160 | 160 | 169 | 160 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 105 °C | 85 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | LFBGA | LFBGA | LFBGA | LFQFP | LFBGA | LFBGA | BGA | LFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 225 | 240 | 240 | 240 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.5 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.6 mm | 1.7 mm | 1.7 mm | 2.5 mm | 1.7 mm |
最大供电电压 | 1.45 V | 1.26 V | 1.26 V | 1.32 V | 1.45 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
最小供电电压 | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
标称供电电压 | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.25 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead/Silver (Sn/Pb/Ag) | TIN LEAD SILVER | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Lead/Silver (Sn/Pb/Ag) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | BALL | BALL | BALL | GULL WING | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 1 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | 40 |
宽度 | 19 mm | 12 mm | 12 mm | 12 mm | 24 mm | 12 mm | 12 mm | 19 mm | 12 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
是否无铅 | 含铅 | - | - | - | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
ECCN代码 | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
其他特性 | ALSO REQUIRES 3V OR 3.3V SUPPLY | - | - | ALSO REQUIRES 3V OR 3.3V SUPPLY | - | ALSO REQUIRES 3V OR 3.3V SUPPLY | ALSO REQUIRES 3V OR 3.3V SUPPLY | ALSO REQUIRES 3V OR 3.3V SUPPLY | ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
位大小 | 32 | - | - | 32 | 32 | 32 | 32 | 32 | 32 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | - | - | - | 3 |
封装等效代码 | BGA169,17X17,40 | - | - | BGA160,14X14,32 | QFP176,1.0SQ,20 | BGA160,14X14,32 | BGA160,14X14,32 | BGA169,17X17,40 | BGA160,14X14,32 |
电源 | 1.2,2.5/3.3 V | - | - | 1.2,2.5/3.3 V | 1.2,2.5/3.3 V | 1.2,2.5/3.3 V | 1.2,2.5/3.3 V | 1.2,2.5/3.3 V | 1.2,2.5/3.3 V |
速度 | 500 MHz | - | - | 756 MHz | 533 MHz | 500 MHz | 400 MHz | 500 MHz | 600 MHz |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
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