Octal Channel Protector in SOIC Package
参数名称 | 属性值 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | SSOP |
包装说明 | SMALL OUTLINE, R-PDSO-G20 |
针数 | 20 |
制造商包装代码 | RS-20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大漏极电流 (ID) | 0.02 A |
最大漏源导通电阻 | 95 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e3 |
湿度敏感等级 | 1 |
端子数量 | 20 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 150 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
极性/信道类型 | N-CHANNEL AND P-CHANNEL |
认证状态 | Not Qualified |
表面贴装 | YES |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
ADG467BRSZ-REEL | ADG467BR | ADG467BRSZ | ADG467BRZ-REEL | ADG467BRZ-REEL7 | |
---|---|---|---|---|---|
描述 | Octal Channel Protector in SOIC Package | Octal Channel Protector in SOIC Package | Octal Channel Protector in SOIC Package | Octal Channel Protector in SOIC Package | Octal Channel Protector in SOIC Package |
Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | SSOP | SOT | SSOP | SOT | SOT |
包装说明 | SMALL OUTLINE, R-PDSO-G20 | SOIC-18 | SMALL OUTLINE, R-PDSO-G20 | SMALL OUTLINE, R-PDSO-G18 | SMALL OUTLINE, R-PDSO-G18 |
针数 | 20 | 18 | 20 | 18 | 18 |
制造商包装代码 | RS-20 | RW-18 | RS-20 | RW-18 | RW-18 |
Reach Compliance Code | compliant | unknown | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大漏极电流 (ID) | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
最大漏源导通电阻 | 95 Ω | 95 Ω | 95 Ω | 95 Ω | 95 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G18 | R-PDSO-G20 | R-PDSO-G18 | R-PDSO-G18 |
JESD-609代码 | e3 | e0 | e3 | e3 | e3 |
湿度敏感等级 | 1 | 3 | 1 | 3 | 3 |
端子数量 | 20 | 18 | 20 | 18 | 18 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 240 | 260 | 260 | 260 |
极性/信道类型 | N-CHANNEL AND P-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES |
端子面层 | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 30 | 30 |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
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