IC PLL FREQUENCY SYNTHESIZER, 7500 MHz, QCC20, MO-220-VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | QFN |
| 包装说明 | MO-220-VGGD-1, LFCSP-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | 5A991.B |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 4 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC20,.16SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4 mm |
| ADF4007BCP | ADF4007BCP-REEL | ADF4007BCP-REEL7 | |
|---|---|---|---|
| 描述 | IC PLL FREQUENCY SYNTHESIZER, 7500 MHz, QCC20, MO-220-VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit | IC PLL FREQUENCY SYNTHESIZER, 7500 MHz, QCC20, MO-220-VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit | IC PLL FREQUENCY SYNTHESIZER, 7500 MHz, QCC20, MO-220-VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | QFN | QFN | QFN |
| 包装说明 | MO-220-VGGD-1, LFCSP-20 | MO-220-VGGD-1, LFCSP-20 | MO-220-VGGD-1, LFCSP-20 |
| 针数 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | 5A991.B | 5A991.B | 5A991.B |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 4 mm | 4 mm | 4 mm |
| 湿度敏感等级 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | LCC20,.16SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 |
| 电源 | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 |
| 宽度 | 4 mm | 4 mm | 4 mm |
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