Standard SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Micron Technology |
| 零件包装代码 | SOJ |
| 包装说明 | 0.300 INCH, PLASTIC, SOJ-32 |
| 针数 | 32 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 20 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J32 |
| JESD-609代码 | e0 |
| 长度 | 20.98 mm |
| 内存密度 | 294912 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 32 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX9 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ32,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.66 mm |
| 最大待机电流 | 0.0004 A |
| 最小待机电流 | 2 V |
| 最大压摆率 | 0.12 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.67 mm |
| MT5C2889DJ-20L | MT5C2889DJ-20LTR | MT5C2889DJ-17L | MT5C2889DJ-17LTR | MT5C2889DJ-15LTR | MT5C2889DJ-15L | MT5C2889DJ-25L | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 32KX9, 17ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 32KX9, 17ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 32KX9, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 32KX9, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 | Standard SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 |
| 零件包装代码 | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ |
| 包装说明 | 0.300 INCH, PLASTIC, SOJ-32 | SOJ, | 0.300 INCH, PLASTIC, SOJ-32 | SOJ, | SOJ, | 0.300 INCH, PLASTIC, SOJ-32 | 0.300 INCH, PLASTIC, SOJ-32 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | unknown | unknown | _compli |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | EAR99 |
| 最长访问时间 | 20 ns | 20 ns | 17 ns | 17 ns | 15 ns | 15 ns | 25 ns |
| JESD-30 代码 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 |
| 长度 | 20.98 mm | 20.98 mm | 20.98 mm | 20.98 mm | 20.98 mm | 20.98 mm | 20.98 mm |
| 内存密度 | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.66 mm | 3.66 mm | 3.66 mm | 3.66 mm | 3.66 mm | 3.66 mm | 3.66 mm |
| 最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.67 mm | 7.67 mm | 7.67 mm | 7.67 mm | 7.67 mm | 7.67 mm | 7.67 mm |
| 是否无铅 | 含铅 | - | 含铅 | - | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | - | 不符合 | 不符合 |
| 厂商名称 | Micron Technology | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| I/O 类型 | COMMON | - | COMMON | - | - | COMMON | COMMON |
| JESD-609代码 | e0 | - | e0 | - | - | e0 | e0 |
| 封装等效代码 | SOJ32,.34 | - | SOJ32,.34 | - | - | SOJ32,.34 | SOJ32,.34 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | - | 5 V | - | - | 5 V | 5 V |
| 最大待机电流 | 0.0004 A | - | 0.0004 A | - | - | 0.0004 A | 0.0004 A |
| 最大压摆率 | 0.12 mA | - | 0.13 mA | - | - | 0.145 mA | 0.11 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
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