Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SK Hynix(海力士) |
零件包装代码 | BGA |
包装说明 | LFBGA, BGA90,9X15,32 |
针数 | 90 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 166 MHz |
I/O 类型 | COMMON |
交错的突发长度 | 1,2,4,8 |
JESD-30 代码 | R-PBGA-B90 |
长度 | 13 mm |
内存密度 | 268435456 bit |
内存集成电路类型 | SYNCHRONOUS DRAM |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 90 |
字数 | 8388608 words |
字数代码 | 8000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 8MX32 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装等效代码 | BGA90,9X15,32 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
座面最大高度 | 1.4 mm |
自我刷新 | YES |
连续突发长度 | 1,2,4,8,FP |
最大待机电流 | 0.002 A |
最大压摆率 | 0.44 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3.135 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 11 mm |
HY5V52CLF-6 | HY5V52CLF-H | HY5V52CLF-P | HY5V52CLF-8 | HY5V52CF-8 | HY5V52CF-P | HY5V52CF-S | HY5V52CF-H | HY5V52CLF-S | |
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描述 | Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 5.5ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 5.5ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 | Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 0.80 MM PITCH, FBGA-90 |
厂商名称 | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 | LFBGA, BGA90,9X15,32 |
针数 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
Reach Compliance Code | compliant | compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns | 5.5 ns | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns | 5.5 ns | 6 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 166 MHz | 133 MHz | 100 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 133 MHz | 100 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
交错的突发长度 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
JESD-30 代码 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 |
长度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
封装等效代码 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
连续突发长度 | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
最大待机电流 | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
最大压摆率 | 0.44 mA | 0.44 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.44 mA | 0.4 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm |
JESD-609代码 | - | - | e1 | e1 | e1 | e1 | e1 | - | e1 |
端子面层 | - | - | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | - | TIN SILVER COPPER |
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