IC DUAL, PARALLEL, WORD INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, CDIP24, 0.300 INCH, GLASS SEALED, CERDIP-24, Digital to Analog Converter
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | DIP |
包装说明 | 0.300 INCH, GLASS SEALED, CERDIP-24 |
针数 | 24 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最大模拟输出电压 | 10 V |
最小模拟输出电压 | -10 V |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY |
输入格式 | PARALLEL, WORD |
JESD-30 代码 | R-GDIP-T24 |
JESD-609代码 | e0 |
最大线性误差 (EL) | 0.0122% |
标称负供电电压 | -15 V |
位数 | 12 |
功能数量 | 2 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-15 V |
认证状态 | Not Qualified |
座面最大高度 | 5.715 mm |
标称安定时间 (tstl) | 3 µs |
最大压摆率 | 10 mA |
标称供电电压 | 15 V |
表面贴装 | NO |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
AD7847BQ | AD7837AR | AD7837BN | AD7837BR | AD7847AN | AD7847AR | |
---|---|---|---|---|---|---|
描述 | IC DUAL, PARALLEL, WORD INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, CDIP24, 0.300 INCH, GLASS SEALED, CERDIP-24, Digital to Analog Converter | LC2MOS Complete, Dual 12-Bit MDAC, (8 + 4) Loading Structure | LC2MOS Complete, Dual 12-Bit MDAC, (8 + 4) Loading Structure | IC DUAL, PARALLEL, WORD INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO24, SOIC-24, Digital to Analog Converter | LC2MOS Complete, Dual 12-Bit MDAC, Parallel Loading Structure | LC2MOS Complete, Dual 12-Bit MDAC, Parallel Loading Structure |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | DIP | SOIC | DIP | SOIC | DIP | SOIC |
包装说明 | 0.300 INCH, GLASS SEALED, CERDIP-24 | SOP, SOP24,.4 | 0.300 INCH, PLASTIC, DIP-24 | SOIC-24 | 0.300 INCH, PLASTIC, DIP-24 | SOP, SOP24,.4 |
针数 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输出电压 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
最小模拟输出电压 | -10 V | -10 V | -10 V | -10 V | -10 V | -10 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | R-GDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0122% | 0.0122% | 0.0244% | 0.0244% |
标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
位数 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | SOP | DIP | SOP |
封装等效代码 | DIP24,.3 | SOP24,.4 | DIP24,.3 | SOP24,.4 | DIP24,.3 | SOP24,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 240 | NOT APPLICABLE | 240 | NOT APPLICABLE | 220 |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.715 mm | 2.65 mm | 4.82 mm | 2.65 mm | 4.82 mm | 2.65 mm |
标称安定时间 (tstl) | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs | 3 µs |
最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | YES | NO | YES | NO | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT APPLICABLE | 30 | NOT APPLICABLE | 20 |
宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm |
Source Url Status Check Date | - | 2013-05-01 14:56:20.927 | 2013-05-01 14:56:20.93 | - | 2013-05-01 14:56:21.077 | 2013-05-01 14:56:21.079 |
Brand Name | - | Analog Devices Inc | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc |
是否无铅 | - | 含铅 | 含铅 | - | 含铅 | 含铅 |
制造商包装代码 | - | RW-24 | N-24-1 | - | N-24-1 | RW-24 |
长度 | - | 15.4 mm | 31.165 mm | 15.4 mm | 31.165 mm | 15.4 mm |
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