IC SERIAL, PARALLEL, WORD INPUT LOADING, 2.5 us SETTLING TIME, 14-BIT DAC, CDIP24, HERMETIC SEALED, CERDIP-24, Digital to Analog Converter
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | DIP |
包装说明 | HERMETIC SEALED, CERDIP-24 |
针数 | 24 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最大模拟输出电压 | 3 V |
最小模拟输出电压 | -3 V |
转换器类型 | D/A CONVERTER |
输入位码 | 2\'S COMPLEMENT BINARY |
输入格式 | SERIAL, PARALLEL, WORD |
JESD-30 代码 | R-GDIP-T24 |
JESD-609代码 | e0 |
最大线性误差 (EL) | 0.0122% |
标称负供电电压 | -5 V |
位数 | 14 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -25 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-5 V |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大稳定时间 | 4 µs |
标称安定时间 (tstl) | 2.5 µs |
最大压摆率 | 14 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | BICMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
AD7840AQ | AD7840BQ | AD7840KN | AD7840SQ | |
---|---|---|---|---|
描述 | IC SERIAL, PARALLEL, WORD INPUT LOADING, 2.5 us SETTLING TIME, 14-BIT DAC, CDIP24, HERMETIC SEALED, CERDIP-24, Digital to Analog Converter | IC SERIAL, PARALLEL, WORD INPUT LOADING, 2.5 us SETTLING TIME, 14-BIT DAC, CDIP24, HERMETIC SEALED, CERDIP-24, Digital to Analog Converter | IC SERIAL, PARALLEL, WORD INPUT LOADING, 2.5 us SETTLING TIME, 14-BIT DAC, PDIP24, PLASTIC, DIP-24, Digital to Analog Converter | IC SERIAL, PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 14-BIT DAC, CDIP24, HERMETIC SEALED, CERDIP-24, Digital to Analog Converter |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | DIP | DIP | DIP | DIP |
包装说明 | HERMETIC SEALED, CERDIP-24 | HERMETIC SEALED, CERDIP-24 | PLASTIC, DIP-24 | HERMETIC SEALED, CERDIP-24 |
针数 | 24 | 24 | 24 | 24 |
Reach Compliance Code | not_compliant | unknown | not_compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C |
最大模拟输出电压 | 3 V | 3 V | 3 V | 3 V |
最小模拟输出电压 | -3 V | -3 V | -3 V | -3 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | BINARY |
输入格式 | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD |
JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-PDIP-T24 | R-GDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 |
最大线性误差 (EL) | 0.0122% | 0.0061% | 0.0061% | 0.0122% |
标称负供电电压 | -5 V | -5 V | -5 V | -5 V |
位数 | 14 | 14 | 14 | 14 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 70 °C | 125 °C |
最低工作温度 | -25 °C | -25 °C | - | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED |
电源 | +-5 V | +-5 V | +-5 V | +-5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.33 mm | 5.08 mm |
最大稳定时间 | 4 µs | 4 µs | 4 µs | 4 µs |
标称安定时间 (tstl) | 2.5 µs | 2.5 µs | 2.5 µs | 2 µs |
最大压摆率 | 14 mA | 14 mA | 14 mA | 15 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO |
技术 | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | OTHER | OTHER | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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