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MT47H64M8HR-3AIT:G: 产品描述DDR DRAM, 64MX8, 0.45ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84; 产品类别存储存储; 文件大小2MB，共129页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

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MT47H64M8HR-3AIT:G概述

DDR DRAM, 64MX8, 0.45ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84

MT47H64M8HR-3AIT:G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	TFBGA,
针数	84
Reach Compliance Code	compliant
ECCN代码	EAR99
访问模式	FOUR BANK PAGE BURST
最长访问时间	0.45 ns
其他特性	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B84
长度	12.5 mm
内存密度	536870912 bit
内存集成电路类型	DDR DRAM
内存宽度	8
功能数量	1
端口数量	1
端子数量	84
字数	67108864 words
字数代码	64000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	64MX8
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
座面最大高度	1.2 mm
自我刷新	YES
最大供电电压 (Vsup)	1.9 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
宽度	8 mm

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Micron Confidential and Proprietary

512Mb: x8, x16 Automotive DDR2 SDRAM

Features

Automotive DDR2 SDRAM

MT47H64M8 – 16 Meg x 8 x 4 banks

MT47H32M16 – 8 Meg x 16 x 4 banks

Features

•

Industrial and automotive temperature compliant

= 1.8V ±0.1V, V

DDQ

= 1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

4 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Programmable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

32ms, 8192-cycle refresh

On-die termination (ODT)

RoHS-compliant

Supports JEDEC clock jitter specification

AEC-Q100

PPAP submisson

8D response time

Options

• Configuration

– 64 Meg x 8 (16 Meg x 8 x 4 banks)

– 32 Meg x 16 (8 Meg x 16 x 4 banks)

• FBGA package (Pb-free) – x8

– 60-ball FBGA (8mm x 10mm)

• FBGA package (Pb-free) – x16

– 84-ball FBGA (8mm x 12.5mm)

• FBGA package (lead solder) – x8

– 60-ball FBGA (8mm x 10mm)

• FBGA package (lead solder) – x16

– 84-ball FBGA (8mm x 12.5mm)

• Timing – cycle time

– 2.5ns @ CL = 5 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

• Self refresh

– Standard

– Low-power

• Operating temperature

– Industrial (–40°C T

+95°C;

–40°C T

+85°C)

– Automotive (–40°C T

, T

+105ºC)

• Revision

Note:

Marking

64M8

32M16

-25E

-3

None

AIT

AAT

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade

-25E

-25

-3E

-3

CL = 3

400

CL = 4

533

667

533

CL = 5

800

667

CL = 6

800

n/a

CL = 7

n/a

(ns)

PDF: 09005aef8440dbbc

512mbddr2_ait_aat.pdf – Rev. C 7/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Confidential and Proprietary

512Mb: x8, x16 Automotive DDR2 SDRAM

Features

Contents

State Diagram .................................................................................................................................................. 8

Functional Description ..................................................................................................................................... 9

Automotive Industrial Temperature ............................................................................................................... 9

Automotive Temperature ............................................................................................................................ 10

General Notes ............................................................................................................................................ 10

Functional Block Diagrams ............................................................................................................................. 11

Ball Assignments and Descriptions ................................................................................................................. 13

Packaging ...................................................................................................................................................... 17

Package Dimensions ................................................................................................................................... 17

FBGA Package Capacitance ......................................................................................................................... 19

Electrical Specifications – Absolute Ratings ..................................................................................................... 20

Temperature and Thermal Impedance ........................................................................................................ 20

Electrical Specifications – I

Parameters ........................................................................................................ 23

Specifications and Conditions ............................................................................................................... 23

DD7

Conditions .......................................................................................................................................... 24

AC Timing Operating Specifications ................................................................................................................ 27

AC and DC Operating Conditions .................................................................................................................... 39

ODT DC Electrical Characteristics ................................................................................................................... 40

Input Electrical Characteristics and Operating Conditions ............................................................................... 41

Output Electrical Characteristics and Operating Conditions ............................................................................. 44

Output Driver Characteristics ......................................................................................................................... 46

Power and Ground Clamp Characteristics ....................................................................................................... 50

AC Overshoot/Undershoot Specification ......................................................................................................... 51

Input Slew Rate Derating ................................................................................................................................ 53

Commands .................................................................................................................................................... 66

Truth Tables ............................................................................................................................................... 66

DESELECT ................................................................................................................................................. 70

NO OPERATION (NOP) ............................................................................................................................... 71

LOAD MODE (LM) ...................................................................................................................................... 71

ACTIVATE .................................................................................................................................................. 71

READ ......................................................................................................................................................... 71

WRITE ....................................................................................................................................................... 71

PRECHARGE .............................................................................................................................................. 72

REFRESH ................................................................................................................................................... 72

SELF REFRESH ........................................................................................................................................... 72

Mode Register (MR) ........................................................................................................................................ 72

Burst Length .............................................................................................................................................. 73

Burst Type .................................................................................................................................................. 74

Operating Mode ......................................................................................................................................... 74

DLL RESET ................................................................................................................................................. 74

Write Recovery ........................................................................................................................................... 75

Power-Down Mode ..................................................................................................................................... 75

CAS Latency (CL) ........................................................................................................................................ 76

Extended Mode Register (EMR) ....................................................................................................................... 77

DLL Enable/Disable ................................................................................................................................... 78

Output Drive Strength ................................................................................................................................ 78

DQS# Enable/Disable ................................................................................................................................. 78

RDQS Enable/Disable ................................................................................................................................. 78

Output Enable/Disable ............................................................................................................................... 78

On-Die Termination (ODT) ......................................................................................................................... 79

PDF: 09005aef8440dbbc

512mbddr2_ait_aat.pdf – Rev. C 7/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Micron Confidential and Proprietary

512Mb: x8, x16 Automotive DDR2 SDRAM

Features

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 79

Posted CAS Additive Latency (AL) ................................................................................................................ 79

Extended Mode Register 2 (EMR2) ................................................................................................................... 81

Extended Mode Register 3 (EMR3) ................................................................................................................... 82

Initialization .................................................................................................................................................. 83

ACTIVATE ...................................................................................................................................................... 86

READ ............................................................................................................................................................. 88

READ with Precharge .................................................................................................................................. 92

READ with Auto Precharge .......................................................................................................................... 94

WRITE ........................................................................................................................................................... 99

PRECHARGE ................................................................................................................................................. 109

REFRESH ...................................................................................................................................................... 110

SELF REFRESH .............................................................................................................................................. 111

Power-Down Mode ........................................................................................................................................ 113

Precharge Power-Down Clock Frequency Change ........................................................................................... 120

Reset ............................................................................................................................................................. 121

CKE Low Anytime ...................................................................................................................................... 121

ODT Timing .................................................................................................................................................. 123

MRS Command to ODT Update Delay ........................................................................................................ 125

PDF: 09005aef8440dbbc

512mbddr2_ait_aat.pdf – Rev. C 7/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Micron Confidential and Proprietary

512Mb: x8, x16 Automotive DDR2 SDRAM

Features

List of Tables

Table 1: Key Timing Parameters ....................................................................................................................... 1

Table 2: Addressing ......................................................................................................................................... 2

Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 15

Table 4: Input Capacitance ............................................................................................................................ 19

Table 5: Absolute Maximum DC Ratings ......................................................................................................... 20

Table 6: Temperature Limits .......................................................................................................................... 21

Table 7: Thermal Impedance ......................................................................................................................... 22

Table 8: General I

Parameters ..................................................................................................................... 23

Table 9: I

DD7

Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 24

Table 10: DDR2 I

Specifications and Conditions ......................................................................................... 25

Table 11: AC Operating Specifications and Conditions .................................................................................... 27

Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 39

Table 13: ODT DC Electrical Characteristics ................................................................................................... 40

Table 14: Input DC Logic Levels ..................................................................................................................... 41

Table 15: Input AC Logic Levels ...................................................................................................................... 41

Table 16: Differential Input Logic Levels ......................................................................................................... 42

Table 17: Differential AC Output Parameters ................................................................................................... 44

Table 18: Output DC Current Drive ................................................................................................................ 44

Table 19: Output Characteristics .................................................................................................................... 45

Table 20: Full Strength Pull-Down Current (mA) ............................................................................................. 46

Table 21: Full Strength Pull-Up Current (mA) .................................................................................................. 47

Table 22: Reduced Strength Pull-Down Current (mA) ...................................................................................... 48

Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 49

Table 24: Input Clamp Characteristics ............................................................................................................ 50

Table 25: Address and Control Balls ................................................................................................................ 51

Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 51

Table 27: AC Input Test Conditions ................................................................................................................ 52

Table 28: DDR2-400/533 Setup and Hold Time Derating Values (

IS and

IH) .................................................... 54

Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (

IS and

IH) ........................................... 55

Table 30: DDR2-400/533

DS,

DH Derating Values with Differential Strobe ...................................................... 58

Table 31: DDR2-667/800/1066

DS,

DH Derating Values with Differential Strobe ............................................. 59

Table 32: Single-Ended DQS Slew Rate Derating Values Using

and

................................................... 60

Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-667 ...................................... 60

Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-533 ...................................... 61

Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-400 ...................................... 61

Table 36: Truth Table – DDR2 Commands ...................................................................................................... 66

Table 37: Truth Table – Current State Bank

– Command to Bank

................................................................ 67

Table 38: Truth Table – Current State Bank

– Command to Bank

............................................................... 69

Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 70

Table 40: Burst Definition .............................................................................................................................. 74

Table 41: READ Using Concurrent Auto Precharge .......................................................................................... 94

Table 42: WRITE Using Concurrent Auto Precharge ....................................................................................... 100

Table 43: Truth Table – CKE .......................................................................................................................... 115

PDF: 09005aef8440dbbc

512mbddr2_ait_aat.pdf – Rev. C 7/11 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H64M8HR-3AIT:G

MT47H64M8HR-3AIT:G概述

MT47H64M8HR-3AIT:G规格参数

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