IC DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 10-BIT DAC, PQCC20, ROHS COMPLIANT, PLASTIC, MO-047AA, LCC-20, Digital to Analog Converter
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | LPCC |
| 包装说明 | QCCJ, LDCC20,.4SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e3 |
| 长度 | 8.965 mm |
| 最大线性误差 (EL) | 0.2% |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大稳定时间 | 1 µs |
| 标称安定时间 (tstl) | 0.8 µs |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 8.965 mm |
| AD7533JPZ-REEL | AD7533KRZ-REEL | AD7533BQ | AD7533KP | AD7533UQ | |
|---|---|---|---|---|---|
| 描述 | IC DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 10-BIT DAC, PQCC20, ROHS COMPLIANT, PLASTIC, MO-047AA, LCC-20, Digital to Analog Converter | CMOS Low Cost, 10-Bit Multiplying DAC | IC DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 10-BIT DAC, CDIP16, CERAMIC, DIP-16, Digital to Analog Converter | IC DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 10-BIT DAC, PQCC20, PLASTIC, MO-047AA, LCC-20, Digital to Analog Converter | CMOS Low Cost, 10-Bit Multiplying DAC |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | LPCC | SOIC | DIP | LPCC | DIP |
| 包装说明 | QCCJ, LDCC20,.4SQ | SOP, SOP16,.4 | DIP-16 | LCC-20 | DIP, DIP16,.3 |
| 针数 | 20 | 16 | 16 | 20 | 16 |
| Reach Compliance Code | unknown | compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | - | 含铅 |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | - | - | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | - | - | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | - | - | PARALLEL, WORD |
| JESD-30 代码 | S-PQCC-J20 | R-PDSO-G16 | - | - | R-GDIP-T16 |
| JESD-609代码 | e3 | e3 | - | - | e0 |
| 长度 | 8.965 mm | 10.3 mm | - | - | 19.05 mm |
| 最大线性误差 (EL) | 0.2% | 0.1% | - | - | 0.05% |
| 位数 | 10 | 10 | - | - | 10 |
| 功能数量 | 2 | 2 | - | - | 2 |
| 端子数量 | 20 | 16 | - | - | 16 |
| 最高工作温度 | 85 °C | 85 °C | - | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCJ | SOP | - | - | DIP |
| 封装等效代码 | LDCC20,.4SQ | SOP16,.4 | - | - | DIP16,.3 |
| 封装形状 | SQUARE | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | - | - | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | - | NOT APPLICABLE |
| 电源 | 15 V | 15 V | - | - | 15 V |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified |
| 座面最大高度 | 4.57 mm | 2.65 mm | - | - | 5.08 mm |
| 最大稳定时间 | 1 µs | 0.8 µs | - | - | 1 µs |
| 标称安定时间 (tstl) | 0.8 µs | 0.8 µs | - | - | 0.8 µs |
| 最大压摆率 | 2 mA | 2 mA | - | - | 2 mA |
| 标称供电电压 | 15 V | 15 V | - | - | 15 V |
| 表面贴装 | YES | YES | - | - | NO |
| 技术 | CMOS | CMOS | - | - | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | - | MILITARY |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | - | Tin/Lead (Sn63Pb37) |
| 端子形式 | J BEND | GULL WING | - | - | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | - | - | 2.54 mm |
| 端子位置 | QUAD | DUAL | - | - | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | - | - | NOT APPLICABLE |
| 宽度 | 8.965 mm | 7.5 mm | - | - | 7.62 mm |
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