1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
3. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2.0%.
I
R
T
J
= 25°C
0.51
0.63
T
J
= 25°C
0.2
Value
24
80
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
T
J
= 125°C
0.475
0.55
T
J
= 125°C
20
mA
V
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
75°C
125°C
25°C
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
125°C
75°C
25°C
1
1
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−02
I
R
, REVERSE CURRENT (AMPS)
125°C
100
25°C
f = 1 MHz
C, CAPACITANCE (pF)
20
30
40
50
60
10
1.0E−03
1.0E−04
1.0E−05
25°C
1.0E−06
1.0E−07
75°C
0
10
0
10
20
30
40
50
60
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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2
MBRS260T3
P
FO
, AVERAGE POWER DISSIPATION (W)
I
F
, AVERAGE FORWARD CURRENT (A)
3.5
3
2.5
2
1.5
1
0.5
0
60
70
80
90
100
110
120
130
SQUARE WAVE
dc
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
SQUARE WAVE
dc
0
0.5
1
1.5
2
2.5
3
T
L
, LEAD TEMPERATURE (°C)
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
−
Junction to Lead
R
T
, TRANSIENT THERMAL RESISTANCE (NORMALIZED) R
T
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 6. Forward Power Dissipation
1.0E+00
50%
20%
1.0E−01 10%
5.0%
1.0E−02 2.0%
1.0%
R
tjl(t)
= R
tjl*r(t)
1.0E−03
1.0E−04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 7. Thermal Response
−
Junction to Case
1.0E+00
50%
20%
10%
5.0%
1.0E−01
1.0E−02 2.0%
1.0E−03 1.0%
R
tjl(t)
= R
tjl*r(t)
1.0E−04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 8. Thermal Response
−
Junction to Ambient
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3
MBRS260T3
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE G
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.13
2.45
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.096
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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