512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8,192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS compliant
Supports JEDEC clock jitter specification
Options
1
•
Configuration
–
256 Meg x 4 (32 Meg x 4 x 4 banks)
–
128 Meg x 8 (16 Meg x 8 x 4 banks)
–
64 Meg x 16 (8 Meg x 16 x 4 banks)
•
FBGA package (Pb-free) – x16
–
84-ball FBGA (12mm x 12.5mm) Rev. B
–
84-ball FBGA (10mm x 12.5mm) Rev. D
–
84-ball FBGA (8mm x 12.5mm) Rev. F
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (12mm x 10mm) Rev. B
–
60-ball FBGA (10mm x 10mm) Rev. D
–
60-ball FBGA (8mm x 10mm) Rev. F
•
FBGA package (lead solder) – x16
–
84-ball FBGA (12mm x 12.5mm) Rev. B
–
84-ball FBGA (10mm x 12.5mm) Rev. D
–
84-ball FBGA (8mm x 12.5mm) Rev. F
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (12mm x 10mm) Rev. B
–
60-ball FBGA (10mm x 10mm) Rev. D
–
60-ball FBGA (8mm x 10mm) Rev. F
•
Timing – cycle time
–
2.5ns @ CL = 5 (DDR2-800)
–
2.5ns @ CL = 6 (DDR2-800)
–
3.0ns @ CL = 4 (DDR2-667)
–
3.0ns @ CL = 5 (DDR2-667)
–
3.75ns @ CL = 4 (DDR2-533)
•
Self refresh
–
Standard
–
Low-power
•
Operating temperature
–
Commercial (0°C
≤
T
C
≤
85°C)
–
Industrial (–40°C
≤
T
C
≤
95°C;
–40°C
≤
T
A
≤
85°C)
–
Automotive, Revision :D only
(–40°C
≤
T
C
, T
A
≤
105°C)
•
Revision
Note:
Marking
128M4
64M8
32M16
CC
BN
HR
CB
B6
CF
GC
FN
HW
GB
F6
JN
-25E
-25
-3E
-3
-37E
None
L
None
IT
AT
:B/:D/:F
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef82f1e6e2
Rev. N 1/09 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Speed Grade
-25E
-25
-3E
-3
-37E
Data Rate (MT/s)
CL = 3
400
400
400
400
400
CL = 4
533
533
667
533
533
CL = 5
800
667
667
667
n/a
CL = 6
800
800
n/a
n/a
n/a
t
RC
(ns)
55
55
54
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
128 Meg x 4
32 Meg x 4 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[11, 9:0] (2K)
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
PDF: 09005aef82f1e6e2
Rev. N 1/09 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number: MT47H128M4B6-25E :D
-
MT47H
Configuration
Package
Speed
:
Revision
{
Configuration
256 Meg x 4
128 Meg x 8
64 Meg x 16
Package
Pb-free
84-ball 12mm x 12.5mm FBGA
84-ball 10mm x 12.5mm FBGA
84-ball 8mm x 12.5mm FBGA
60-ball 12mm x 10mm FBGA
60-ball 10mm x 10mm FBGA
60-ball 8mm x 10mm FBGA
Lead Solder
84-ball 12mm x 12.5mm FBGA
84-ball 10mm x 12.5mm FBGA
84-ball 8mm x 12.5mm FBGA
60-ball 12mm x 10mm FBGA
60-ball 10mm x 10mm FBGA
60-ball 8mm x 10mm FBGA
GC
FN
HW
GB
F6
JN
CC
BN
HR
CB
B6
CF
-37E
-3
-3E
-25
-25E
Speed Grade
tCK = 3.75ns, CL = 4
tCK = 3ns, CL = 5
tCK = 3ns, CL = 4
tCK = 2.5ns, CL = 6
tCK = 2.5ns, CL = 5
128M4
64M8
32M16
L Low power
IT Industrial temperature
AT Automotive temperature
:B/:D/:F Revision
Note:
1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef82f1e6e2
Rev. N 1/09 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 20
Package Dimensions .................................................................................................................................. 20
FBGA Package Capacitance ......................................................................................................................... 26
Electrical Specifications – Absolute Ratings ..................................................................................................... 27
Temperature and Thermal Impedance ........................................................................................................ 27
Electrical Specifications – Idd Parameters ........................................................................................................ 30
Idd Specifications and Conditions ............................................................................................................... 30
Idd7 Conditions ......................................................................................................................................... 31
AC Timing Operating Specifications ................................................................................................................ 35
AC and DC Operating Conditions .................................................................................................................... 46
ODT DC Electrical Characteristics ................................................................................................................... 47
Input Electrical Characteristics and Operating Conditions ............................................................................... 48
Output Electrical Characteristics and Operating Conditions ............................................................................. 51
Output Driver Characteristics ......................................................................................................................... 53
Power and Ground Clamp Characteristics ....................................................................................................... 57
AC Overshoot/Undershoot Specification ......................................................................................................... 58
Input Slew Rate Derating ................................................................................................................................ 60
Commands .................................................................................................................................................... 74
Truth Tables ............................................................................................................................................... 74
DESELECT ................................................................................................................................................. 78
NO OPERATION (NOP) .............................................................................................................................. 79
LOAD MODE (LM) ..................................................................................................................................... 79
ACTIVATE .................................................................................................................................................. 79
READ ......................................................................................................................................................... 79
WRITE ....................................................................................................................................................... 79
PRECHARGE .............................................................................................................................................. 80
REFRESH ................................................................................................................................................... 80
SELF REFRESH ........................................................................................................................................... 80
Mode Register (MR) ........................................................................................................................................ 80
Burst Length .............................................................................................................................................. 81
Burst Type ................................................................................................................................................. 81
Operating Mode ......................................................................................................................................... 83
DLL RESET ................................................................................................................................................. 83
Write Recovery ........................................................................................................................................... 84
Power-Down Mode .................................................................................................................................... 84
CAS Latency (CL) ........................................................................................................................................ 85
Extended Mode Register (EMR) ....................................................................................................................... 86
DLL Enable/Disable ................................................................................................................................... 87
Output Drive Strength ................................................................................................................................ 87
DQS# Enable/Disable ................................................................................................................................. 87
RDQS Enable/Disable ................................................................................................................................. 87
Output Enable/Disable ............................................................................................................................... 87
On-Die Termination (ODT) ........................................................................................................................ 88
Contents
PDF: 09005aef82f1e6e2
Rev. N 1/09 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 88
Posted CAS Additive Latency (AL) ............................................................................................................... 88
Extended Mode Register 2 (EMR2) .................................................................................................................. 90
Extended Mode Register 3 (EMR3) .................................................................................................................. 91
Initialization .................................................................................................................................................. 92
ACTIVATE ...................................................................................................................................................... 96
READ ............................................................................................................................................................. 98
READ with Precharge ................................................................................................................................ 102
READ with Auto Precharge ......................................................................................................................... 104
WRITE .......................................................................................................................................................... 109
PRECHARGE ................................................................................................................................................. 119
REFRESH ...................................................................................................................................................... 120
SELF REFRESH .............................................................................................................................................. 121
Power-Down Mode ....................................................................................................................................... 123
Precharge Power-Down Clock Frequency Change .......................................................................................... 130
Reset ............................................................................................................................................................. 131
CKE Low Anytime ...................................................................................................................................... 131
ODT Timing .................................................................................................................................................. 133
MRS Command to ODT Update Delay ........................................................................................................ 135
PDF: 09005aef82f1e6e2
Rev. N 1/09 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
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