REVISIONS
LTR
A
DESCRIPTION
Add case outline 2 for device types 01 and 02. Update format. Editorial
changes throughout.
Changes to large-signal voltage gain test and to the output voltage swing test.
Changes IAW NOR 5962-R193-93.
Add case outline K. Change boilerplate to add one-part part numbers. Add
delta test limits. Redrawn.
Add radiation hardness requirements. Update boilerplate. -rrp
Change to the slew rate test condition A
VCL
in table I. -rrp
Add case outline D. Remove radiation exposure circuit. Changes made to
1.2.4, 1.3, 3.2.3, figure 1, and table IIA. Update boilerplate to reflect current
requirements. -rrp
DATE (YR-MO-DA)
89-11-07
APPROVED
M. A. Frye
B
93-08-26
M. A. Frye
C
96-11-25
R. Monnin
D
E
F
98-06-19
00-10-04
03-03-19
R. Monnin
R. Monnin
R. Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Gary Zahn
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Michael A Frye
MICROCIRCUIT, LINEAR, RADIATION
HARDENED, LOW NOISE, QUAD OPERATIONAL
AMPLIFIERS, MONOLITHIC SILICON
DRAWING APPROVAL DATE
88-08-18
AMSC N/A
REVISION LEVEL
F
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-88565
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E298-03
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
88565
01
C
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
R
88565
01
V
C
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
OP-470A
OP-471A
Circuit function
Very low noise, quad, operational amplifier
High speed, low noise, quad, operational
amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88565
SHEET
F
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
D
2
3
K
Descriptive designator
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
CQCC1-N28
GDFP2-F24 or CDFP3-F24
Terminals
14
14
20
28
24
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
CC
) .......................................................
Differential input voltage ..................................................
Differential input current ..................................................
Input voltage ....................................................................
Output short circuit duration ............................................
Storage temperature range .............................................
Lead temperature (soldering, 60 seconds) .....................
Power dissipation (P
D
):
Cases C and 2 .............................................................
Case D .........................................................................
Case 3 .........................................................................
Case K .........................................................................
Maximum junction temperature (T
J
) ................................
Thermal resistance, junction-to-case (θ
JC
) ......................
Thermal resistance, junction-to-ambient (θ
JA
):
Cases C and 2 .............................................................
Case D .........................................................................
Case 3 .........................................................................
Case K .........................................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ..................... -55°C to +125°C
Supply voltage (V
CC
) .......................................................
±15
V
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s)................. 100 Krads(Si) 3/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
±18
V dc
±1
V dc 2/
±25
mA 2/
Supply voltage
Continuous
-65°C to +150°C
+300°C
800 mW
550 mW
500 mW
440 mW
+150°C
See MIL-STD-1835
100°C/W
140°C/W
110°C/W
69°C/W
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise
performance. If the differential input voltage exceeds
±1
V, the input current should be limited to
±25
mA.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method
1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88565
SHEET
F
3
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88565
SHEET
F
4
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/
-55°C
≤
T
A
≤+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
2, 3
Device
type
Min
01
Limits
Max
±0.4
±0.6
±0.6
Unit
Input offset voltage
V
IO
mV
M,D,P,L,R
1
1
2, 3
02
±0.8
±1.2
±1.0
M,D,P,L,R
Input offset current
I
IO
V
CM
= 0 V
1
1
2, 3
All
±10
±20
50
nA
M,D,P,L,R
Input bias current
I
IB
V
CM
= 0 V
1
1
2, 3
All
±25
±50
±500
nA
M,D,P,L,R
Input noise voltage
E
n
f
O
= 1 Hz to 100 Hz
T
A
= +25°C
3/
1
7
01
02
110
265
1000
750
100
500
400
nV
RMS
Large-signal voltage gain
A
VS
V
O
=
±10
V,
R
L
= 10 kΩ
4
5, 6
M,D,P,L,R
4
4
3/
5, 6
01
V/mV
V
O
=
±10
V,
R
L
= 2 kΩ
V
O
=
±10
V,
R
L
= 10 kΩ
4
5, 6
M,D,P,L,R
4
02
500
375
50
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88565
SHEET
F
5
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