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SNJ54HCT08W: 产品描述AND Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14; 产品类别逻辑逻辑; 文件大小745KB，共16页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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SNJ54HCT08W概述

AND Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14

SNJ54HCT08W规格参数

参数名称	属性值
厂商名称	Rochester Electronics
包装说明	CERAMIC, DFP-14
Reach Compliance Code	unknown
系列	HCT
JESD-30 代码	R-GDFP-F14
长度	9.21 mm
逻辑集成电路类型	AND GATE
功能数量	4
输入次数	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
传播延迟（tpd）	35 ns
筛选级别	MIL-PRF-38535
座面最大高度	2.03 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	6.285 mm

SNJ54HCT08W相似产品对比

	SNJ54HCT08W	SN74HCT08DG4	SN74HCT08PWTG4	SN74HCT08PWRE4	SN74HCT08DBRG4	SN74HCT08PWTE4	SNJ54HCT08FK
描述	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDSO14, GREEN, PLASTIC, SOIC-14	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDSO14, GREEN, PLASTIC, TSSOP-14	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDSO14, GREEN, PLASTIC, TSSOP-14	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDSO14, GREEN, PLASTIC, SSOP-14	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDSO14, GREEN, PLASTIC, TSSOP-14	AND Gate, HCT Series, 4-Func, 2-Input, CMOS, CQCC20, CERAMIC, LCC-20
包装说明	CERAMIC, DFP-14	GREEN, PLASTIC, SOIC-14	GREEN, PLASTIC, TSSOP-14	GREEN, PLASTIC, TSSOP-14	SSOP,	TSSOP,	CERAMIC, LCC-20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	HCT	HCT	HCT	HCT	HCT	HCT	HCT
JESD-30 代码	R-GDFP-F14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	S-CQCC-N20
长度	9.21 mm	8.65 mm	5 mm	5 mm	6.2 mm	5 mm	8.89 mm
逻辑集成电路类型	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE
功能数量	4	4	4	4	4	4	4
输入次数	2	2	2	2	2	2	2
端子数量	14	14	14	14	14	14	20
最高工作温度	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C
最低工作温度	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	SOP	TSSOP	TSSOP	SSOP	TSSOP	QCCN
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	FLATPACK	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER
传播延迟（tpd）	35 ns	30 ns	30 ns	30 ns	30 ns	30 ns	35 ns
座面最大高度	2.03 mm	1.75 mm	1.2 mm	1.2 mm	2 mm	1.2 mm	2.03 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
端子形式	FLAT	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD
端子节距	1.27 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
宽度	6.285 mm	3.9 mm	4.4 mm	4.4 mm	5.3 mm	4.4 mm	8.89 mm
厂商名称	Rochester Electronics	-	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics

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