RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA360,19X19,50 |
| 针数 | 360 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 32 |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 66.6 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FLOATING POINT |
| 集成缓存 | YES |
| JESD-30 代码 | S-CBGA-B360 |
| JESD-609代码 | e0 |
| 长度 | 25 mm |
| 低功率模式 | YES |
| 端子数量 | 360 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | BGA |
| 封装等效代码 | BGA360,19X19,50 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.92 mm |
| 速度 | 266 MHz |
| 最大压摆率 | 5640 mA |
| 最大供电电压 | 2.1 V |
| 最小供电电压 | 1.9 V |
| 标称供电电压 | 2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 25 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| AMD-K6/266BCZ | AMD-K6/233ACZ | AMD-K6/266ACZ | AMD-K6/300BDZ | AMD-K6/300ADZ | AMD-K6/233BCZ | |
|---|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CPGA321, STAGGERED, CERAMIC, PGA-321 | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CPGA321, STAGGERED, CERAMIC, PGA-321 | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CPGA321, STAGGERED, CERAMIC, PGA-321 | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | PGA | PGA | BGA | PGA | BGA |
| 包装说明 | BGA, BGA360,19X19,50 | IPGA, SPGA321,37X37 | IPGA, SPGA321,37X37 | BGA, BGA360,19X19,50 | IPGA, SPGA321,37X37 | BGA, BGA360,19X19,50 |
| 针数 | 360 | 321 | 321 | 360 | 321 | 360 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 66.6 MHz | 66.6 MHz | 66.6 MHz | 66.6 MHz | 66.6 MHz | 66.6 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 集成缓存 | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-CBGA-B360 | S-CPGA-P321 | S-CPGA-P321 | S-CBGA-B360 | S-CPGA-P321 | S-CBGA-B360 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 25 mm | 49.53 mm | 49.53 mm | 25 mm | 49.53 mm | 25 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES |
| 端子数量 | 360 | 321 | 321 | 360 | 321 | 360 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | BGA | IPGA | IPGA | BGA | IPGA | BGA |
| 封装等效代码 | BGA360,19X19,50 | SPGA321,37X37 | SPGA321,37X37 | BGA360,19X19,50 | SPGA321,37X37 | BGA360,19X19,50 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 2,3.3 V | 2,3.3 V | 2,3.3 V | 2.1,3.3 V | 2.1,3.3 V | 2,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.92 mm | 3.63 mm | 3.63 mm | 2.92 mm | 3.63 mm | 2.92 mm |
| 速度 | 266 MHz | 233 MHz | 266 MHz | 300 MHz | 300 MHz | 233 MHz |
| 最大压摆率 | 5640 mA | 5170 mA | 5640 mA | 6060 mA | 6060 mA | 5170 mA |
| 最大供电电压 | 2.1 V | 2.1 V | 2.1 V | 2.2 V | 2.2 V | 2.1 V |
| 最小供电电压 | 1.9 V | 1.9 V | 1.9 V | 2 V | 2 V | 1.9 V |
| 标称供电电压 | 2 V | 2 V | 2 V | 2.1 V | 2.1 V | 2 V |
| 表面贴装 | YES | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | PIN/PEG | PIN/PEG | BALL | PIN/PEG | BALL |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | BOTTOM | PERPENDICULAR | PERPENDICULAR | BOTTOM | PERPENDICULAR | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 25 mm | 49.53 mm | 49.53 mm | 25 mm | 49.53 mm | 25 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| 厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
