Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDIP16,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.56 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 传播延迟(tpd) | 10.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |





| SN54F251AJ | SNJ54F251AFK | SN54F251AFK | SNJ54F251AJ | |
|---|---|---|---|---|
| 描述 | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDIP16, | F/FAST SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20 | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CQCC20, | Multiplexer, F/FAST Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, TTL, CDIP16, |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | QCCN, | QCCN, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T16 |
| 长度 | 19.56 mm | 8.89 mm | 8.89 mm | 19.56 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 |
| 输出次数 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 20 | 20 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | QCCN | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 传播延迟(tpd) | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns |
| 认证状态 | Not Qualified | COMMERCIAL | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL |
| 宽度 | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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