IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16, Cordless Telephone IC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Toshiba(东芝) |
| 零件包装代码 | SOIC |
| 包装说明 | LSSOP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大压摆率 | 9 mA |
| 标称供电电压 | 3.2 V |
| 表面贴装 | YES |
| 电信集成电路类型 | CORDLESS TELEPHONE SUPPORT CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| TA31170FN-TP1 | TA31170FN(EL) | TA31170FN-TP2 | TA31170FN | TA31170FN(ER) | |
|---|---|---|---|---|---|
| 描述 | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16, Cordless Telephone IC | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16, Cordless Telephone IC | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16, Cordless Telephone IC | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16, Cordless Telephone IC | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16, Cordless Telephone IC |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | LSSOP, | LSSOP, | LSSOP, | LSSOP, | LSSOP, |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大压摆率 | 9 mA | 9 mA | 9 mA | 9 mA | 9 mA |
| 标称供电电压 | 3.2 V | 3.2 V | 3.2 V | 3.2 V | 3.2 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 电信集成电路类型 | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - |
| JESD-609代码 | e0 | - | e0 | e0 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
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