OP-AMP, 6000 uV OFFSET-MAX, 300 MHz BAND WIDTH, PDSO14
运算放大器, 6000 uV 最大补偿, 300 MHz 波段 宽度, PDSO14
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最大供电/工作电压 | 5.5 V |
| 最大工作温度 | 85 Cel |
| 最小工作温度 | -40 Cel |
| 额定供电电压 | 5 V |
| 额定带宽 | 300 kHz |
| 额定旋转率 | 1250 V/us |
| 最大输入失调电压 | 6000 mV |
| 加工封装描述 | GREEN, PLASTIC, TSSOP-14 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | ACTIVE |
| 工艺 | BIPOLAR |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子间距 | 0.6500 mm |
| 端子涂层 | NICKEL PALLADIUM GOLD |
| 端子位置 | DUAL |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | INDUSTRIAL |
| 放大器类型 | OP-AMP |
| 额定共模抑制比 | 114 dB |
| 最大输入偏置电流IIB | 40 uA |
| THS7530PWP | THS7530 | THS7530PWPG4 | THS7530PWPR | THS7530PWPRG4 | |
|---|---|---|---|---|---|
| 描述 | OP-AMP, 6000 uV OFFSET-MAX, 300 MHz BAND WIDTH, PDSO14 | OP-AMP, 6000 uV OFFSET-MAX, 300 MHz BAND WIDTH, PDSO14 | OP-AMP, 6000 uV OFFSET-MAX, PDSO20 | OP-AMP, 6000 uV OFFSET-MAX, 300 MHz BAND WIDTH, PDSO14 | OP-AMP, 6000 uV OFFSET-MAX, PDSO20 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 20 | 14 | 20 |
| 最大供电/工作电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
| 最小工作温度 | -40 Cel | -40 Cel | -40 Cel | -40 Cel | -40 Cel |
| 额定供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 额定旋转率 | 1250 V/us | 1250 V/us | 1250 V/us | 1250 V/us | 1250 V/us |
| 最大输入失调电压 | 6000 mV | 6000 mV | 6000 mV | 6000 mV | 6000 mV |
| 加工封装描述 | GREEN, PLASTIC, TSSOP-14 | GREEN, PLASTIC, TSSOP-14 | POWERPAD, THERMALLY ENHANCED, GREEN, PLASTIC, TSSOP-20 | GREEN, PLASTIC, TSSOP-14 | POWERPAD, THERMALLY ENHANCED, GREEN, PLASTIC, TSSOP-20 |
| 无铅 | Yes | Yes | Yes | Yes | Yes |
| 欧盟RoHS规范 | Yes | Yes | Yes | Yes | Yes |
| 中国RoHS规范 | Yes | Yes | Yes | Yes | Yes |
| 状态 | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| 工艺 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 包装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 表面贴装 | Yes | Yes | Yes | Yes | Yes |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子间距 | 0.6500 mm | 0.6500 mm | 0.6500 mm | 0.6500 mm | 0.6500 mm |
| 端子涂层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 放大器类型 | OP-AMP | OP-AMP | OP-AMP | OP-AMP | OP-AMP |
| 额定共模抑制比 | 114 dB | 114 dB | 44 dB | 114 dB | 44 dB |
| 最大输入偏置电流IIB | 40 uA | 40 uA | 40 uA | 40 uA | 40 uA |
| 额定带宽 | 300 kHz | 300 kHz | - | 300 kHz | - |
嵌入式系统
电子竞赛
stm32/stm8
FPGA/CPLD
微控制器 MCU
FPGA/CPLD
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
