LUXEON Flip Chip
Chip Scale Package LED
Introduction
Philips Lumileds LUXEON
®
Flip Chip LED Technology enables the next generation of lighting applications.
Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level
and customize the phosphor and packaging to best suit their lighting applications.
LUXEON Flip Chip is a real Chip Scale Package LED that can be attached by reflow without additional packaging.
Traditional wire bonding limits the packing and power density of LEDs. LUXEON Flip Chip LEDs can be packaged
closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen
output at higher lumen densities.
This document contains the performance data needed to design and engineer Philips Lumileds LUXEON Flip Chip
based application.
Features
•
High drive current up to
1A/mm
2
•
1.0
mm x
1.0
mm 5-sided emitter
•
440-460 nm wave length
•
Low typical forward voltage of 2.9V
•
Low thermal resistance
•
Symmetric, large bond pads bumped
with AuSn solder
Benefits
•
High current density for high
lumen and lm/$ at high lm/W
•
High-packaging density
•
5-sided emitter for dispense and
remote phosphor applications
•
Surface mount capable
•
No wire bonds
•
Robust design with proven
Lumileds reliability
Key Applications
•
High-power LED emitters
•
Chip on board applications
•
Remote phosphor applications
LUXEON Flip Chip DS116 ©2013 Philips Lumileds Lighting Company.
Table of Contents
Product Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Environmental Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Relative Spectral Power Distribution vs . Wavelength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Forward Current vs . Forward Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Typical Relative Radiometric Power vs . Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Peak Wavelength Shift vs . Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Relative Radiometric Power vs . Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Peak Wavelength Shift vs . Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Typical Translation from Peak Wavelength to Dominant Wavelength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Radiation Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bin Structure for LUXEON Flip Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company.
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Product Nomenclature
The part number designation for LUXEON Flip Chip follows:
LHDF-RB10abcdefghi
Where:
RB
10
a
b
cd
– designates color (RB for Royal Blue)
– designates die dimension (10 for 1.0mm
2
)
– designates peak wave length bin (Values 3, 4, 5, 6 per description of bin codes)
– designates bond pad finish (A for pad bumped with AuSn solder)
– open slot to accommodate additional product requirements
efgh – minimum radiometric power performance (mW)
i
– additional product designator (default value = 1)
Environmental Compliance
Philips Lumileds is committed to providing environmentally friendly products to the solid-state lighting market. LUXEON Flip
Chip is compliant to the European Union directives on the restriction of hazardous substances in electronic equipment, namely
the RoHS and REACH directives. Philips Lumileds will not intentionally add the following restricted material to the LUXEON
Flip Chip: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers
(PBDE).
LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company.
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Product Performance and Characterization Guide
Table 1. Optical Characteristics at T
j
= 25°C, I
f
= 350 mA
Part
Number
LHDF-RB10300000000
LHDF-RB10400000000
LHDF-RB10500000000
LHDF-RB10600000000
Notes for Table 1:
1. Philips Lumileds maintains a tolerance of ±2nm for peak wavelength measurements.
2. Please see Figure 8 for typical translation from peak wavelength to dominant wavelength.
3. Measured between 25°C and 85°C at I
f
= 350 mA.
Peak Wavelength (nm)
[1,2]
Min .
440
445
450
455
Max .
445
450
455
460
24
0.05
Typical Spectra
Half-width
(nm)
Typical Temperature
Coefficient of
Peak Wavelength
[3]
(nm/°C)
Table 2. Performance Characteristics at T
j
= 25°C, I
f
= 350 mA
Part Number
LHDF-RB10300005000
LHDF-RB10400005000
LHDF-RB10500005000
LHDF-RB10600004500
Notes for Table 2:
1. Radiometric power values are based on a die packaged on ceramic tile with high reflective surface and dome encapsulation.
2. Philips Lumileds maintains a tolerance of ± 6.5% on radiometric power measurements.
3. H/C factor is the radiometric power ratio between 25°C and 85°C at I
f
= 350 mA.
Min . Radiometric Power (mW)
[1,2]
500
500
500
450
0.95
Typical H/C factor
[3]
Table 3. Electrical Characteristics at T
j
= 25°C, I
f
= 350 mA
Part Number
LHDF-RB10400000000
Notes for Table 3:
1. Philips Lumileds maintains a tolerance of ±0.06V on forward voltage measurements.
2. Measured between 25°C and 85°C at I
f
= 350 mA.
Forward Voltage (V)
[1]
Min .
2.7
Typ .
2.9
Max .
3.1
Typical Temperature Coefficient of Forward Voltage
[2]
(mV/°C)
DV
f
/DT
J
-2 to -3
LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company.
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Absolute Maximum Ratings
Table 4. Operating Condition and Ratings
Parameter
DC Forward Current
[1] [2]
Peak Pulsed Forward Current
[3]
Storage Temperature
LED Junction Temperature
ESD Sensitivity
[4]
Reverse Voltage
Notes for Table 4:
1. Proper current de-rating must be observed to maintain the junction temperature below the specified maximum junction temperature.
2. Residual periodic variations due to power conversion from alternating current (AC) to direct current (DC), also called “ripple”, with frequencies
≥
100Hz and amplitude
≤
250 mA are acceptable, assuming the average current throughout each cycle does not exceed the specified maximum DC forward current and the junction temperature is
kept below the specified maximum junction temperature.
3. Pulsed operation with a peak drive current of 1300 mA is acceptable if the pulse on-time is
≤
5ms per cycle and the duty cycle is
≤
50%.
4. Please see the LUXEON Flip Chip application brief for additional information on ESD protection.
[1]
Maximum Performance
1050 mA
1300 mA
-40°C - 135°C
135°C
≤
200V (HBM, CLASS 0B per JS-001-2012)
LUXEON Flip Chip is not designed to be driven in reverse bias
Mechanical Dimensions
Figure 1. Mechanical Dimensions, LUXEON Flip Chip LHDF-RB10 xxxx xxxx x.
Notes for Figure 1:
1. Drawing is not scale.
2. All dimensions are in micrometers .
3. A notch in the bond pad center indicates the anode.
4. The bond pads are bumped with AuSn solder.
5. LUXEON Flip Chip is qualified for AuSn reflow attach on ceramic and MCPCB substrates.
LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company.
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