OTP ROM, 64KX8, 120ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | QFJ |
| 包装说明 | QCCJ, LDCC32,.5X.6 |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 524288 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.55 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 11.43 mm |
| AT27C512R-12JA | AT27C512R-90JA | AT27C512R-15PA | AT27C512R-15JA | AT27C512R-90PA | AT27C512R-12PA | 2SC2911 | |
|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 64KX8, 120ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 | OTP ROM, 64KX8, 90ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 | OTP ROM, 64KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 | OTP ROM, 64KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | OTP ROM, 64KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | High Switching Speed |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | - |
| 零件包装代码 | QFJ | QFJ | DIP | QFJ | DIP | DIP | - |
| 包装说明 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | - |
| 针数 | 32 | 32 | 28 | 32 | 28 | 28 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最长访问时间 | 120 ns | 90 ns | 150 ns | 150 ns | 90 ns | 120 ns | - |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - |
| JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 长度 | 13.97 mm | 13.97 mm | 36.95 mm | 13.97 mm | 36.95 mm | 36.95 mm | - |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | - |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | - |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 湿度敏感等级 | 2 | 2 | 1 | 2 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 32 | 32 | 28 | 32 | 28 | 28 | - |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | - |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | - |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | QCCJ | QCCJ | DIP | QCCJ | DIP | DIP | - |
| 封装等效代码 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 3.55 mm | 3.55 mm | 5.59 mm | 3.55 mm | 5.59 mm | 5.59 mm | - |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | YES | NO | YES | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | - |
| 宽度 | 11.43 mm | 11.43 mm | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
聊聊、笑笑、闹闹
模拟与混合信号
电源技术
电子竞赛
RF/无线
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
