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SI4972DYT1

产品描述Small Signal Field-Effect Transistor, 10.8A I(D), 30V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, ROHS COMPLIANT, MS-012, SOIC-8
产品类别分立半导体    晶体管   
文件大小282KB,共15页
制造商Vishay(威世)
官网地址http://www.vishay.com
下载文档 详细参数 全文预览

SI4972DYT1概述

Small Signal Field-Effect Transistor, 10.8A I(D), 30V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, ROHS COMPLIANT, MS-012, SOIC-8

SI4972DYT1规格参数

参数名称属性值
厂商名称Vishay(威世)
包装说明SMALL OUTLINE, R-PDSO-G8
Reach Compliance Codeunknown
ECCN代码EAR99
配置SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压30 V
最大漏极电流 (ID)10.8 A
最大漏源导通电阻0.0145 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码MS-012AA
JESD-30 代码R-PDSO-G8
元件数量2
端子数量8
工作模式ENHANCEMENT MODE
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
极性/信道类型N-CHANNEL
表面贴装YES
端子形式GULL WING
端子位置DUAL
晶体管应用SWITCHING
晶体管元件材料SILICON

SI4972DYT1文档预览

Si4972DY
Vishay Siliconix
Dual N-Channel 30-V (D-S) MOSFET
FEATURES
I
D
(A)
a
Q
g
(Typ.)
10.8
9.3
7.2
6.2
8.3
PRODUCT SUMMARY
V
DS
(V)
Channel 1
30
R
DS(on)
(Ω)
0.0145 at V
GS
= 10 V
0.0195 at V
GS
= 4.5 V
0.0265 at V
GS
= 10 V
0.036 at V
GS
= 4.5 V
Halogen-free According to IEC 61249-2-21
Available
• TrenchFET
®
Power MOSFET
• 100 % R
g
Tested
Channel 2
30
4
APPLICATIONS
• Logic DC/DC for Notebook PC
D
1
D
2
SO-8
S
1
G
1
S
2
G
2
1
2
3
4
Top
View
8
7
6
5
D
1
D
1
D
2
D
2
G
1
G
2
S
1
Ordering Information:
Si4972DY-T1-E3 (Lead (Pb)-free)
Si4972DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel
MOSFET
S
2
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
Symbol
V
DS
V
GS
Channel 1
30
± 20
10.8
8.7
8.7
b,c
6.9
b,c
20
2.5
1.6
b,c
20
15
11
3.1
2.1
2.0
b,c
1.25
b,c
- 55 to 150
7.2
5.7
6.4
b,c
5.1
b,c
20
2.1
1.6
b,c
20
6
1.8
2.5
1.6
2.0
b,c
1.25
b,c
Channel 2
Unit
V
Continuous Drain Current (T
J
= 150 °C)
I
D
Pulsed Drain Current (10 µs Pulse Width)
Source-Drain Current Diode Current
Pulsed Source-Drain Current
Single Pulse Avalanche Current
Avalanche Energy
I
DM
I
S
I
SM
I
AS
E
AS
A
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
mJ
Maximum Power Dissipation
P
D
W
Operating Junction and Storage Temperature Range
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
b, d
Maximum Junction-to-Foot (Drain)
Symbol
R
thJA
R
thJF
Channel 1
Typical
Maximum
52
62.5
32
40
Channel 2
Typical
Maximum
55
62.5
40
50
Unit
°C/W
t
10 s
Steady
Notes:
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 110 °C/W (Ch 1) and 120 °C/W (Ch 2).
Document Number: 73849
S09-0138-Rev. D, 02-Feb-09
www.vishay.com
1
Si4972DY
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate Threshold Voltage
Gate-Body Leakage
Symbol
Test Conditions
V
GS
= 0 V, I
D
= 250 µA
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
I
D
= 250 µA
I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
On-State Drain Current
b
I
D(on)
V
DS
= 5 V, V
GS
= 10 V
V
DS
= 5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 6 A
V
GS
= 10 V, I
D
= 4.5 A
V
GS
= 4.5 V, I
D
= 5.6 A
V
GS
= 4.5 V, I
D
= 4 A
Forward Transconductance
b
Dynamic
a
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
iss
C
oss
C
rss
Channel 2
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
V
DS
= 15 V, V
GS
= 10 V, I
D
= 5 A
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 5 A
Channel 1
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 5 A
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Q
gs
Q
gd
R
g
Channel 2
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 5 A
f = 1 MHz
Ch 1
Channel 1
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
1080
515
170
91
72
38
18.5
9.6
8.3
4
3.9
1.9
2.7
1.3
2.5
2.9
3.8
4.4
Ω
28
15
13
6
nC
pF
g
fs
V
DS
= 15 V, I
D
= 6 A
V
DS
= 15 V, I
D
= 4.5 A
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
10
10
0.012
0.022
0.016
0.030
27
20
0.0145
0.0265
0.0195
0.036
S
Ω
1.5
1.5
Min.
30
30
35
35
- 6.5
- 6.5
3.0
3.0
100
100
1
1
10
10
A
µA
V
nA
Typ.
a
Max.
Unit
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
V
mV/°C
Drain-Source On-State
Resistance
b
R
DS(on)
www.vishay.com
2
Document Number: 73849
S09-0138-Rev. D, 02-Feb-09
Si4972DY
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Dynamic
a
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Ch 1
Channel 1
V
DD
= 15 V, R
L
= 3
Ω
I
D
5 A, V
GEN
= 10 V, R
g
= 1
Ω
Channel 2
V
DD
= 15 V, R
L
= 3
Ω
I
D
5 A, V
GEN
= 10 V, R
g
= 1
Ω
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Channel 1
V
DD
= 15 V, R
L
= 3
Ω
I
D
5 A, V
GEN
= 4.5 V, R
g
= 1
Ω
Channel 2
V
DD
= 15 V, R
L
= 3
Ω
I
D
5 A, V
GEN
= 4.5 V, R
g
= 16
Ω
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
I
S
= 1.6 A
I
S
= 1.6 A
Ch 1
Ch 2
Ch 1
Ch 2
Channel 1
I
F
= 2 A, dI/dt = 100 A/µs, T
J
= 25 °C
Channel 2
I
F
= 2 A, dI/dt = 100 A/µs, T
J
= 25 °C
Ch 1
Ch 2
Ch 1
Ch 2
Ch 1
Ch 2
0.77
0.79
21
18
15
11
13
11
8
7
12
10
55
60
30
22
7
6
120
108
150
130
29
19
13
26
18
15
83
90
45
33
11
9
180
162
225
195
44
29
20
39
2.5
2.1
20
20
1.2
1.2
42
36
30
22
Symbol
Test Conditions
Min.
Typ.
a
Max.
Unit
ns
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode
Current
Pulse Diode Forward
Body Diode Voltage
Body Diode Reverse Recovery
Time
Body Diode Reverse Recovery
Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
Current
a
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
T
C
= 25 °C
A
V
ns
nC
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width
300 µs, duty cycle
2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 73849
S09-0138-Rev. D, 02-Feb-09
www.vishay.com
3
Si4972DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
30
V
GS
= 10
V
thru 4
V
24
I
D
- Drain C
u
rrent (A)
I
D
- Drain C
u
rrent (A)
1.6
2.0
18
1.2
12
0.8
T
C
= 125 °C
25 °C
6
3
V
0
0.0
0.4
- 55 °C
0.0
0.5
1.0
1.5
2.0
2.5
0
1
2
3
4
5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics (Ch 1)
0.020
1500
Transfer Characteristics (Ch 1)
R
DS(on)
- On-Resistance (m )
0.018
C - Capacitance (pF)
1200
V
GS
= 4.5
V
C
iss
0.016
900
0.014
V
GS
= 10
V
0.012
600
300
C
oss
0.010
0
6
12
18
24
30
0
0
C
rss
6
12
18
24
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage (Ch 1)
10
I
D
= 5 A
V
GS
- Gate-to-So
u
rce
V
oltage (
V
)
8
R
DS(on)
- On-Resistance
(
N
ormalized)
V
DS
= 10
V
6
V
DS
= 15
V
1.4
1.6
I
D
= 6 A
Capacitance (Ch 1)
V
GS
= 10
V
1.2
V
GS
= 4.5
V
4
V
DS
= 20
V
2
1.0
0.8
0
0
4
8
12
16
20
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge (Ch 1)
On-Resistance vs. Junction Temperature (Ch 1)
www.vishay.com
4
Document Number: 73849
S09-0138-Rev. D, 02-Feb-09
Si4972DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
R
DS(on)
- Drain-to-So
u
rce On-Resistance ( )
T
J
= 150 °C
10
I
S
- So
u
rce C
u
rrent (A)
T
J
= 25 °C
0.10
I
D
= 6 A
0.08
1
0.06
0.1
0.04
T
A
= 125 °C
0.02
T
A
= 25 °C
0.00
0
1
2
3
4
5
6
7
8
9
10
0.01
0.001
0.00
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage (Ch 1)
0.6
I
D
= 250
µA
0.3
V
GS(th)
V
ariance (
V
)
50
On-Resistance vs. Gate-to-Source (Ch 1)
40
Power (W)
0.0
I
D
= 5 mA
30
- 0.3
20
- 0.6
10
- 0.9
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
T
J
- Temperature (°C)
Threshold Voltage (Ch 1)
100
Limited
by
R
DS(on)
*
Single Pulse Power, Junction-to-Ambient (Ch 1)
10
I
D
- Drain C
u
rrent (A)
1 ms
1
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
1s
10 s
DC
0.01
0.1
*
V
GS
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient (Ch 1)
Document Number: 73849
S09-0138-Rev. D, 02-Feb-09
www.vishay.com
5

 
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