EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ABLIC |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大时钟频率 (fCLK) | 2 MHz |
JESD-30 代码 | R-PDIP-T8 |
长度 | 9.3 mm |
内存密度 | 2048 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 128 words |
字数代码 | 128 |
工作模式 | SYNCHRONOUS |
组织 | 128X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 4 mm |
串行总线类型 | MICROWIRE |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.8 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | NO |
技术 | CMOS |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
S-93C56BDP | S-93C46BDFJ | S-93C66BFJ | S-93C56BFJ | S-93C56BDFJ | S-93C66BDFJ | S-93C46BFJ | S-93C46BDP | S-93C66BDP | |
---|---|---|---|---|---|---|---|---|---|
描述 | EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 64X16, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | DIP | DIP |
包装说明 | DIP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | DIP, | DIP, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 |
长度 | 9.3 mm | 5.02 mm | 5.02 mm | 5.02 mm | 5.02 mm | 5.02 mm | 5.02 mm | 9.3 mm | 9.3 mm |
内存密度 | 2048 bit | 1024 bit | 4096 bit | 2048 bit | 2048 bit | 4096 bit | 1024 bit | 1024 bit | 4096 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 128 words | 64 words | 256 words | 128 words | 128 words | 256 words | 64 words | 64 words | 256 words |
字数代码 | 128 | 64 | 256 | 128 | 128 | 256 | 64 | 64 | 256 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
组织 | 128X16 | 64X16 | 256X16 | 128X16 | 128X16 | 256X16 | 64X16 | 64X16 | 256X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP | SOP | SOP | SOP | SOP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4 mm | 4 mm |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | NO | YES | YES | YES | YES | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm |
厂商名称 | ABLIC | - | - | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
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