EEPROM, 1KX8, Parallel, CMOS, PDIP24,
| 参数名称 | 属性值 |
| 厂商名称 | Hughes Aircraft |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | 10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION |
| 数据保留时间-最小值 | 10 |
| JESD-30 代码 | R-PDIP-T24 |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| HI3208-C-P-000 | HI3208-C-D-000 | HC3208-C-D-000 | HB3208-C-P-000 | HB3208-C-D-000 | |
|---|---|---|---|---|---|
| 描述 | EEPROM, 1KX8, Parallel, CMOS, PDIP24, | EEPROM, 1KX8, Parallel, CMOS, CDIP24, | EEPROM, 1KX8, Parallel, CMOS, CDIP24, | EEPROM, 1KX8, Parallel, CMOS, PDIP24, | EEPROM, 1KX8, Parallel, CMOS, CDIP24, |
| 厂商名称 | Hughes Aircraft | Hughes Aircraft | Hughes Aircraft | Hughes Aircraft | Hughes Aircraft |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION | 10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION | 10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION | 10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION | 10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION |
| 数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 |
| JESD-30 代码 | R-PDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-PDIP-T24 | R-CDIP-T24 |
| 内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -55 °C | -55 °C |
| 组织 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
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