ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 24 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大模拟输入电压 | 5.25 V |
最小模拟输入电压 | -5.25 V |
最长转换时间 | 18 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
长度 | 30.545 mm |
最大线性误差 (EL) | 0.0244% |
标称负供电电压 | -5 V |
模拟输入通道数量 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY |
输出格式 | SERIAL, PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
采样速率 | 0.1 MHz |
采样并保持/跟踪并保持 | TRACK |
座面最大高度 | 4.572 mm |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
MAX191AENG-T | MAX191BENG-T | MAX191BCNG-T | MAX191ACNG-T | |
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描述 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | DIP | DIP | DIP | DIP |
包装说明 | DIP, | DIP, | DIP, | DIP, |
针数 | 24 | 24 | 24 | 24 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小模拟输入电压 | -5.25 V | -5.25 V | -5.25 V | -5.25 V |
最长转换时间 | 18 µs | 18 µs | 18 µs | 18 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm |
最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
标称负供电电压 | -5 V | -5 V | -5 V | -5 V |
模拟输入通道数量 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY |
输出格式 | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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