Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm
2
1 oz. copper bond pad, on a FR4 board)
Symbol
R
θJC
Typ
−
Max
1.8
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 2)
(i
F
= 10 Amps, T
J
= 125°C)
(i
F
= 10 Amps, T
J
= 25°C)
Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, T
J
= 125°C)
(Rated dc Voltage, T
J
= 25°C)
v
F
V
0.53
0.62
16
0.035
0.65
0.76
mA
30
0.100
i
R
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
TYPICAL CHARACTERISTICS
100
i
F
, INSTANTANEOUS FORWARD
CURRENT (A)
T
A
= 175°C
T
A
= 150°C
10
T
A
= 125°C
100
i
F
, INSTANTANEOUS FORWARD
CURRENT (A)
T
A
= 175°C
T
A
= 150°C
10
T
A
= 125°C
1
T
A
= 25°C
1
T
A
= 25°C
0.1
T
A
=
−40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.1
T
A
=
−40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward
Characteristics
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
1.E−11
T
A
=
−40°C
0
10
20
30
40
50
60
T
A
= 25°C
T
A
= 125°C
T
A
= 150°C
T
A
= 175°C
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
Figure 2. Maximum Instantaneous Forward
Characteristics
T
A
= 175°C
T
A
= 125°C
T
A
= 150°C
T
A
= 25°C
T
A
=
−40°C
0
10
20
30
40
50
60
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
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2
MBR1060MFS, NRVB1060MFS
TYPICAL CHARACTERISTICS
10,000
C, JUNCTION CAPACITANCE (pF)
T
J
= 25°C
I
F(AV)
, AVERAGE FORWARD
CURRENT (A)
20
18
16
14
12
10
8
6
4
2
0
R
qJC
= 1.8°C/W
Square Wave
dc
1000
100
10
0
10
20
30
40
50
60
0
20
40
60
80
100
120
140
160 180
V
R
, REVERSE VOLTAGE (V)
T
C
, CASE TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
8
P
F(AV)
, AVERAGE FORWARD
POWER DISSIPATION (W)
7
6
5
4
3
2
1
0
0
1
2
3
Figure 6. Current Derating TO−220AB
I
PK
/I
AV
= 20
I
PK
/I
AV
= 10
T
J
= 175°C
I
PK
/I
AV
= 5
Square Wave
dc
4
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
100
R(t) (°C/W)
50% Duty Cycle
20%
10 10%
5%
2%
1 1%
Assumes 25°C ambient and soldered to
a 600 mm
2
−
oz copper pad on PCB
Single Pulse
0.1
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 8. Thermal Characteristics
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3
MBR1060MFS, NRVB1060MFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE H
2X
0.20 C
D
2
D1
A
B
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15 BSC
4.70
4.90
5.10
3.80
4.00
4.20
6.15 BSC
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.05
0.17
0.20
3.00
3.40
3.80
0
_
−−−
12
_
0.20 C
E1
2
E
c
4X
q
A1
1
2
3
4
TOP VIEW
3X
C
SEATING
PLANE
0.10 C
A
0.10 C
SIDE VIEW
8X
e
DETAIL A
DETAIL A
b
e/2
1
4
SOLDERING FOOTPRINT*
1.270
3X
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.10
0.05
C A B
c
L
0.750
4X
1.000
K
4X
0.965
1.330
M
0.905
4.530
0.475
2X
2X
PIN 5
(EXPOSED PAD)
E2
L1
0.495
3.200
2X
G
D2
BOTTOM VIEW
1.530
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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