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AK63264W-15

产品描述SRAM Module, 256KX8, 15ns, CMOS, SIM-64
产品类别存储    存储   
文件大小179KB,共2页
制造商ACCUTEK
官网地址http://www.accutekmicro.com/
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AK63264W-15概述

SRAM Module, 256KX8, 15ns, CMOS, SIM-64

AK63264W-15规格参数

参数名称属性值
厂商名称ACCUTEK
零件包装代码SIMM
包装说明,
针数64
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间15 ns
其他特性ALSO CONFIGURABLE AS 64K X 32
JESD-30 代码R-XSMA-N64
内存密度2097152 bit
内存集成电路类型SRAM MODULE
内存宽度8
功能数量1
端子数量64
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX8
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
并行/串行PARALLEL
认证状态Not Qualified
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子位置SINGLE

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Accutek
Microcircuit
Corporation
DESCRIPTION
The Accutek AK63264 SRAM Module consists of fast high perfor-
mance SRAMs mounted on a low profile, 64 pin SIM or ZIP Board.
The module utilizes four 28 pin 64K x 4 SRAMs in SOJ packages
and four decoupling capacitors on each side of a printed circuit
board.
The SRAMs used have common I/O functions and single output en-
able functions. Also, four separate chip select (CE) connections are
used to independently enable the four bytes. The modules can be
supplied in a variety of access time values from 12 nSEC to
45 nSEC in CMOS or BiCMOS technology.
The Accutek module is designed to have a maximum seated height
of 0.600 inch SIM or 0.500 inch ZIP to provide for the lowest height
off the board. By offset-mounting the back surface SRAMs on the
SIM version the module can be mounted in either angled or
straight-up SIM sockets. Each conforms to JEDEC - standard sizes
and pin-out configurations. Using two pins for module memory den-
sity identification, PD
0
and PD
1
, minimizes interchangeability and
design considerations when changing from one module size to the
other in customer applications.
1
AK63264W/AK63264Z
65,536 x 32 Bit CMOS/BiCMOS
Static Random Access Memory
Front View
64-Pin SIM
32
33
64
64-Pin ZIP
1
32
33
64
FEATURES
·
65,536 x 32 bit organization
·
JEDEC Standard 64 pin SIM or ZIP format
·
Common I/O, single OE functions with four separate chip
selects (CE)
·
Low height, 0.600 inch SIM or 0.500 inch ZIP maximum
·
Upward compatible with 128K x 32 (AK632128), 256K x 32
(AK632256) and 1 Meg x 32 (AK6321024) designs
·
Presence Detect, PD
0
and PD
1
for identifying module density
·
Fast Access Times range from 12 nSEC BiCMOS to 45 nSEC
CMOS
·
TTL-compatible inputs and outputs
·
Single +5 Volt (±10%) power supply
·
Operating temperature range in free air, 0
0
C to 70
0
C
ELECTRICAL SPECIFICATIONS
Timing diagrams and basic electrical characteristics are those of
the standard 64K x 4 SRAMs used to construct these modules.
Accutek’s module design allows the flexibility of selecting indus-
try-compatible 64K x 4 SRAMs from at least seven semiconductor
manufacturers.
PIN NOMENCLATURE
A
0
- A
15
CE
1
- CE
4
DQ
1
- DQ
32
OE
PD
0
- PD
1
Vcc
Vss
WE
Address Inputs
Chip Enable
Data In/Data Out
Output Enable
Presence Detect
5v Supply
Ground
Write Enable
PIN ASSIGNMENT
PIN #
SYMBOL
PIN #
SYMBOL
PIN #
SYMBOL
PIN #
SYMBOL
FUNCTIONAL DIAGRAM
CE
4
CE
3
NC
NC
OE
Vss
DQ
25
DQ
17
DQ
26
DQ
18
DQ
27
DQ
19
DQ
28
DQ
20
A
3
A
10
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
A
4
A
11
A
5
A
12
Vcc
A
13
A
6
DQ
21
DQ
29
DQ
22
DQ
30
DQ
23
DQ
31
DQ
24
DQ
32
Vss
1
2
3
4
5
6
7
8
9
10
11
Vss
PD
0
PD
1
DQ
1
DQ
9
DQ
2
DQ
10
DQ
3
DQ
11
DQ
4
DQ
12
Vcc
A
0
A
7
A
1
A
8
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
A
2
A
9
DQ
13
DQ
5
DQ
14
DQ
6
DQ
15
DQ
7
DQ
16
DQ
8
Vss
WE
A
15
A
14
CE
2
CE
1
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
MODULE OPTIONS
Leadless SIM:
Leaded SIP:
Leaded ZIP:
AK63264W
AK63264G
AK63264Z
12
13
14
15
16
PD
0
= Open
PD
1
= Vss

AK63264W-15相似产品对比

AK63264W-15 AK63264W-12 AK63264Z-12 AK63264G-15 AK63264Z-15
描述 SRAM Module, 256KX8, 15ns, CMOS, SIM-64 SRAM Module, 256KX8, 12ns, BICMOS, 0.600 INCH, SIM-64 SRAM Module, 256KX8, 12ns, BICMOS, ZIP-64 SRAM Module, 256KX8, 15ns, CMOS, SIP-64 SRAM Module, 256KX8, 15ns, CMOS, 0.500 INCH, ZIP-64
厂商名称 ACCUTEK ACCUTEK ACCUTEK ACCUTEK ACCUTEK
零件包装代码 SIMM SIMM ZIP MODULE ZIP
针数 64 64 64 64 64
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 15 ns 12 ns 12 ns 15 ns 15 ns
其他特性 ALSO CONFIGURABLE AS 64K X 32 CONFIGURABLE AS 64K X 32 CONFIGURABLE AS 64K X 32 ALSO CONFIGURABLE AS 64K X 32 ALSO CONFIGURABLE AS 64K X 32
JESD-30 代码 R-XSMA-N64 R-XSMA-N64 R-XZMA-T64 R-XSMA-T64 R-XZMA-T64
内存密度 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
内存集成电路类型 SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
内存宽度 8 8 8 8 8
功能数量 1 1 1 1 1
端子数量 64 64 64 64 64
字数 262144 words 262144 words 262144 words 262144 words 262144 words
字数代码 256000 256000 256000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C
组织 256KX8 256KX8 256KX8 256KX8 256KX8
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO
技术 CMOS BICMOS BICMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子位置 SINGLE SINGLE ZIG-ZAG SINGLE ZIG-ZAG

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