SRAM Module, 256KX8, 15ns, CMOS, SIM-64
| 参数名称 | 属性值 |
| 厂商名称 | ACCUTEK |
| 零件包装代码 | SIMM |
| 包装说明 | , |
| 针数 | 64 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 15 ns |
| 其他特性 | ALSO CONFIGURABLE AS 64K X 32 |
| JESD-30 代码 | R-XSMA-N64 |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | SINGLE |

| AK63264W-15 | AK63264W-12 | AK63264Z-12 | AK63264G-15 | AK63264Z-15 | |
|---|---|---|---|---|---|
| 描述 | SRAM Module, 256KX8, 15ns, CMOS, SIM-64 | SRAM Module, 256KX8, 12ns, BICMOS, 0.600 INCH, SIM-64 | SRAM Module, 256KX8, 12ns, BICMOS, ZIP-64 | SRAM Module, 256KX8, 15ns, CMOS, SIP-64 | SRAM Module, 256KX8, 15ns, CMOS, 0.500 INCH, ZIP-64 |
| 厂商名称 | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK |
| 零件包装代码 | SIMM | SIMM | ZIP | MODULE | ZIP |
| 针数 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 15 ns | 12 ns | 12 ns | 15 ns | 15 ns |
| 其他特性 | ALSO CONFIGURABLE AS 64K X 32 | CONFIGURABLE AS 64K X 32 | CONFIGURABLE AS 64K X 32 | ALSO CONFIGURABLE AS 64K X 32 | ALSO CONFIGURABLE AS 64K X 32 |
| JESD-30 代码 | R-XSMA-N64 | R-XSMA-N64 | R-XZMA-T64 | R-XSMA-T64 | R-XZMA-T64 |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | BICMOS | BICMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | SINGLE | SINGLE | ZIG-ZAG | SINGLE | ZIG-ZAG |
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