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UPD43256BCZ-85L

产品描述Standard SRAM, 32KX8, 85ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
产品类别存储    存储   
文件大小185KB,共24页
制造商NEC(日电)
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UPD43256BCZ-85L概述

Standard SRAM, 32KX8, 85ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

UPD43256BCZ-85L规格参数

参数名称属性值
厂商名称NEC(日电)
零件包装代码DIP
包装说明DIP,
针数28
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间85 ns
其他特性BATTERY BACKUP
JESD-30 代码R-PDIP-T28
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度8
功能数量1
端子数量28
字数32768 words
字数代码32000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度5.72 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度15.24 mm

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DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD43256B
256K-BIT CMOS STATIC RAM
32K-WORD BY 8-BIT
Description
The
µ
PD43256B is a high speed, low power, and 262, 144 bits (32,768 words by 8 bits) CMOS static RAM.
Battery backup is available (L, LL, A, and B versions). And A and B versions are wide voltage operations.
The
µ
PD43256B is packed in 28-pin plastic DIP, 28-pin plastic SOP and 28-pin plastic TSOP (I).
Features
• 32,768 words by 8 bits organization
• Fast access time: 70, 85, 100, 120, 150 ns (MAX.)
• Wide voltage range (A version: V
CC
= 3.0 to 5.5 V, B version: V
CC
= 2.7 to 5.5 V)
• 2 V data retention
• OE input for easy application
Operating
supply voltage
V
4.5 to 5.5
Operating
temperature
°C
0 to 70
Standby
supply current
µ
A (MAX.)
50
15
3.0 to 5.5
2.7 to 5.5
Data retention
supply current
Note 1
µ
A (MAX.)
3
2
Part number
Access time
ns (MAX.)
70, 85
70, 85
85, 100
Note 2
, 120
Note 2
100, 120, 150
µ
PD43256B-L
µ
PD43256B-LL
µ
PD43256B-A
µ
PD43256B-B
Note 2
Notes 1.
T
A
40 ˚C, V
CC
= 3 V
2.
Access time : 85 ns (MAX.) (V
CC
= 4.5 to 5.5 V)
Version X and P
This data sheet can be applied to the version X and P. Each version is identified with its lot number. Letter X in
the fifth character position in a lot number signifies version X, letter P, version P.
JAPAN
D43256B
Lot number
The information in this document is subject to change without notice.
Document No. M10770EJ9V0DS00 (9th edition)
Date Published May 1997 N
Printed in Japan
The mark
shows major revised points.
©
1990, 1993, 1994

UPD43256BCZ-85L相似产品对比

UPD43256BCZ-85L UPD43256BGW-85LL-9JL UPD43256BGU-85LL UPD43256BGW-85LL-9KL UPD43256BGW-A85-9JL UPD43256BCZ-85LL UPD43256BGW-B10-9KL UPD43256BGW-B15-9KL
描述 Standard SRAM, 32KX8, 85ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, REVERSE, TSOP1-28 Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 Standard SRAM, 32KX8, 85ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, REVERSE, TSOP1-28 Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, REVERSE, TSOP1-28
零件包装代码 DIP TSOP SOIC TSOP TSOP DIP TSOP TSOP
包装说明 DIP, TSOP1, SOP, TSOP1-R, TSOP1, DIP, TSOP1-R, TSOP1-R,
针数 28 28 28 28 28 28 28 28
Reach Compliance Code unknown compliant compliant compliant compliant unknown compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 85 ns 85 ns 85 ns 85 ns 85 ns 85 ns 85 ns 85 ns
其他特性 BATTERY BACKUP BATTERY BACKUP BATTERY BACKUP BATTERY BACKUP BATTERY BACKUP BATTERY BACKUP BATTERY BACKUP BATTERY BACKUP
JESD-30 代码 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28
内存密度 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端子数量 28 28 28 28 28 28 28 28
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000 32000 32000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP TSOP1 SOP TSOP1-R TSOP1 DIP TSOP1-R TSOP1-R
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.72 mm 1.2 mm 2.95 mm 1.2 mm 1.2 mm 5.72 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
端子节距 2.54 mm 0.55 mm 1.27 mm 0.55 mm 0.55 mm 2.54 mm 0.55 mm 0.55 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 15.24 mm 8 mm 8.4 mm 8 mm 8 mm 15.24 mm 8 mm 8 mm
厂商名称 NEC(日电) NEC(日电) - NEC(日电) NEC(日电) NEC(日电) NEC(日电) NEC(日电)
是否Rohs认证 - 不符合 不符合 不符合 不符合 - 不符合 不符合
JESD-609代码 - e0 e0 e0 e0 - e0 e0
长度 - 11.8 mm 18 mm 11.8 mm 11.8 mm - 11.8 mm 11.8 mm
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
端子面层 - TIN LEAD TIN LEAD TIN LEAD TIN LEAD - TIN LEAD TIN LEAD
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED

 
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