FPGA, 1764 CLBS, 476000 GATES, PBGA516, FPBGA-516
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | BGA |
包装说明 | BGA, |
针数 | 516 |
Reach Compliance Code | unknown |
其他特性 | ALSO OPERATES WITH 3.3V SUPPLY |
CLB-Max的组合延迟 | 0.93 ns |
JESD-30 代码 | S-PBGA-B516 |
JESD-609代码 | e0 |
长度 | 31 mm |
湿度敏感等级 | 3 |
可配置逻辑块数量 | 1764 |
等效关口数量 | 476000 |
端子数量 | 516 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 1764 CLBS, 476000 GATES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 225 |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | COMMERCIAL |
座面最大高度 | 2.6 mm |
最大供电电压 | 2.7 V |
最小供电电压 | 2.3 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 31 mm |
LFX500EB-04FH516I | LFX500EB-03FH516I | LFX500EB-03FH516C | LFX500EB-05FH516C | LFX200B-05FH516C | LFX200B-04FH516C | LFX200C-04FH516C | LFX200EB-03FH516C | LFX200EB-03FH516I | LFX200EB-04FH516C | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | FPGA, 1764 CLBS, 476000 GATES, PBGA516, FPBGA-516 | FPGA, 1764 CLBS, 476000 GATES, PBGA516, FPBGA-516 | FPGA, 1764 CLBS, 476000 GATES, PBGA516, FPBGA-516 | FPGA, 1764 CLBS, 476000 GATES, PBGA516, FPBGA-516 | FPGA, 676 CLBS, 210000 GATES, PBGA516, FPBGA-516 | FPGA, 676 CLBS, 210000 GATES, PBGA516, FPBGA-516 | FPGA, 676 CLBS, 210000 GATES, PBGA516, FPBGA-516 | FPGA, 676 CLBS, 210000 GATES, PBGA516, FPBGA-516 | FPGA, 676 CLBS, 210000 GATES, PBGA516, FPBGA-516 | FPGA, 676 CLBS, 210000 GATES, PBGA516, FPBGA-516 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
针数 | 516 | 516 | 516 | 516 | 516 | 516 | 516 | 516 | 516 | 516 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow | unknow | unknow |
CLB-Max的组合延迟 | 0.93 ns | 1.07 ns | 1.07 ns | 0.86 ns | 0.86 ns | 0.93 ns | 0.93 ns | 1.07 ns | 1.07 ns | 0.93 ns |
JESD-30 代码 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 | S-PBGA-B516 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
可配置逻辑块数量 | 1764 | 1764 | 1764 | 1764 | 676 | 676 | 676 | 676 | 676 | 676 |
等效关口数量 | 476000 | 476000 | 476000 | 476000 | 210000 | 210000 | 210000 | 210000 | 210000 | 210000 |
端子数量 | 516 | 516 | 516 | 516 | 516 | 516 | 516 | 516 | 516 | 516 |
最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
组织 | 1764 CLBS, 476000 GATES | 1764 CLBS, 476000 GATES | 1764 CLBS, 476000 GATES | 1764 CLBS, 476000 GATES | 676 CLBS, 210000 GATES | 676 CLBS, 210000 GATES | 676 CLBS, 210000 GATES | 676 CLBS, 210000 GATES | 676 CLBS, 210000 GATES | 676 CLBS, 210000 GATES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm | 2.6 mm |
最大供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 1.95 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 1.65 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm | 31 mm |
其他特性 | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | - | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY | ALSO OPERATES WITH 3.3V SUPPLY |
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