Stacked Film Capacitor Chips
NSWC Series
FEATURES
NSWC IS
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
RECOMMENDED
• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES
FOR NEW DESIGNS
• WIDE TEMPERATURE RANGE UP TO +125
O
C*
• HIGH HEAT AND MOISTURE RESISTANT
RoHS
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
Compliant
includes all homogeneous materials
nCHARACTERISTICS
• REFLOW SOLDERING ONLY
*See Part Number System for Details
• TAPE AND REEL PACKAGING
SPECIFICATIONS
Capacitance Range
Votage Ratings
Capacitance Tolerance
Temperature Range
Dissipation factor (20°C)
Insulation resistance (20°C)
Dielectric Withstanding
Voltage
1206
0.001 ~ 0.0047μF
Case Sizes
1913
2416
2820
3022
3925
1210
0.0056 ~ 0.01μF 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF
100Vdc
0.001 ~ 0.01μF 5% (J) only,
0.012 ~ 0.15μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only
-55°C ~ +105°C (0.001μF ~ 0.01μF)
-55°C ~ +125°C (0.012μF ~ 1.0μF with derating above +85°C)
1.0% max. @ 1KHz
3 Gigohms or 1000Ω/F whichever is lower
150% of Rated Voltage 60 Seconds
ENVIRONMENTAL CHARACTERISTICS
Life Test At +105°C
1,000 Hours at 125% of Rated Voltage
(125°C for 0.012μF ~ 1.0μF)
Resistance to Soldering Heat:
+240°C Peak
Humidity Load Life (90% ~ 95% RH)
(1) 1,000 Hours, +40°C
500 Hours for 0.012μF ~ 1.0μF
(2) 500 Hours, +60°C
for 0.001 ~ 0.01μF
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within +1%/-6% of Initial Value
1.1% Maximum
1 Gigohm Minimum or 300Ω/F whichever is lower
Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value
1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF
1 Gigohm Minimum or 300Ω/F whichever is lower
(1) +8%/-5%
(2) ±10% of Initial Value
(1) 1.5% Max.
(2) 2.0% Max.
(1) 100 Megohm Min. or 30Ω/F
(2) 10 Megohm Min. or 3Ω/F
whichever is lower
90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot
RECOMMENDED LAND
PATTERN (mm)
Temperature - Deg. C
EIA Size
1206
1210
1913
2416
2820
3022
3925
A
1.8
1.8
2.6
3.8
4.5
5.1
7.2
B
3.6
3.6
6.6
7.8
9.0
9.7
11.9
C
1.4
2.3
3.0
3.8
4.6
5.0
5.7
RECOMMENDED REFLOW PROFILE
300
250
200
150
100
50
25
Ramp-up
25°C ~ 150°C
90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Cool Down
Time above 220°C
60 sec. max.
Standard: +240 °C Peak Temperature
+250°C Special Order
(see part numbering system)
C
0
Time
A
B
PART NUMBER SYSTEM
NSWC 823 J 100 TR D4 N F
RoHS Compliant
Optional High Temp. Reflow (+250°C)*
Size Code
Tape & Reel
Voltage
Tolerance Code: J = ±5%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
*Special packaging and handling required.
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
NXP MCU
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