Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125
O
C (100pF ~ 0.1μF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
NSHC Series
includes all homogeneous materials
RoHS
Compliant
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt.
-55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C)
0.6% max. @ 1KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds or
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3%
ΔC
Maximum Over Temperature Range
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
1,000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat
+260°C Peak
Humidity Load Life:
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
(3) 500 Hours +85°C/85% RH
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±2% of Initial Value
0.68% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
(1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value
(1) & (2) 0.90% Maximum (3) 1.2% maximum
(1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE
(maximum 2 times)
300
Peak Temperature
260°C
Temperature - Deg. C
RECOMMENDED LAND
PATTERN (mm)
Case Code
J1
A1, A2
B1, B2, B3
C2, C3
D5, D6
E6, E7, E8
EIA Size
0603
0805
1206
1210
1913
2416
A
0.6
0.8
1.8
1.8
3.0
4.0
B
2.0
2.4
3.6
3.6
5.6
7.0
C
0.7
1.1
1.4
2.3
3.0
3.8
250
200
150
100
50
25
Ramp-up
25°C ~ 150°C
90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Cool Down
Time above 230°C
30 sec. max.
0
Time
Solder within 1 year. Storage at +30°C and 60% RH
A
B
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
C
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
Stacked Film Capacitor Chips
16V STANDARD PRODUCTS AND CASE SIZES
Part Number
NSHC101J16TRJ1F
NSHC121J16TRJ1F
NSHC151J16TRJ1F
NSHC181J16TRJ1F
NSHC221J16TRJ1F
NSHC271J16TRJ1F
NSHC331J16TRJ1F
NSHC391J16TRJ1F
NSHC471J16TRJ1F
NSHC561J16TRJ1F
NSHC681J16TRJ1F
NSHC821J16TRJ1F
NSHC102J16TRJ1F
NSHC122J16TRJ1F
NSHC152J16TRJ1F
NSHC182J16TRJ1F
NSHC222J16TRJ1F
NSHC272J16TRJ1F
NSHC332J16TRA1F
NSHC392J16TRA1F
NSHC472J16TRA1F
NSHC562J16TRA1F
NSHC682J16TRA1F
NSHC822J16TRA2F
NSHC103J16TRA2F
NSHC123J16TRB1F
NSHC153J16TRB1F
NSHC183J16TRB1F
NSHC223J16TRB1F
NSHC273J16TRB2F
NSHC333J16TRB2F
NSHC393J16TRB3F
NSHC473J16TRB3F
NSHC563J16TRC2F
NSHC683J16TRC2F
NSHC823J16TRC3F
NSHC104J16TRC3F
Cap.
Value
100pF
120
150
180
220
270
330
390
470
560
680
820
0.001
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
Cap.
Code
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
Size
Code
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
A1
A1
A1
A1
A1
A2
A2
B1
B1
B1
B1
B2
B2
B3
B3
C2
C2
C3
C3
Length
L ±0.2
Width
W
Height
H ±0.2
NSHC Series
p
EIA
1.6
0.8 ± 0.15
0.7 ± 0.15
0.35 ± 0.20
0603
0.9
2.0
1.25 ± 0.2
1.1
0.45 ± 0.25
0805
0.9
3.2
1.6 ± 0.2
1.1
1.5
1.5
3.2
2.5 ± 0.2
2.1
0.65 ± 0.35
1210
0.65 ± 0.35
1206
OUTLINE DRAWING
Stacked Element Terminations:
95.5% Sn, 4% Ag and
0.5% Cu over phenolic
resin/Ag/Ni/Cu over copper
base
H
p
L
2
L
1
p
W
Stacked Film Capacitor Chips
50V STANDARD PRODUCTS AND CASE SIZES
Part Number
NSHC101J50TRA1F
NSHC121J50TRA1F
NSHC151J50TRA1F
NSHC181J50TRA1F
NSHC221J50TRA1F
NSHC271J50TRA1F
NSHC331J50TRA1F
NSHC391J50TRA1F
NSHC471J50TRA1F
NSHC561J50TRA1F
NSHC681J50TRA1F
NSHC821J50TRA1F
NSHC102J50TRA1F
NSHC122J50TRA1F
NSHC152J50TRA1F
NSHC182J50TRA1F
NSHC222J50TRA1F
NSHC272J50TRA1F
NSHC332J50TRB1F
NSHC392J50TRB1F
NSHC472J50TRB1F
NSHC562J50TRB1F
NSHC682J50TRB1F
NSHC822J50TRB2F
NSHC103J50TRB2F
NSHC123J50TRC1F
NSHC153J50TRC1F
NSHC183J50TRC2F
NSHC223J50TRC2F
NSHC273J50TRC2F
NSHC333J50TRC3F
NSHC393J50TRC3F
NSHC473J50TRD5F
NSHC563J50TRD5F
NSHC683J50TRD5F
NSHC823J50TRD6F
NSHC104J50TRD6F
NSHC124J50TRE6F
NSHC154J50TRE6F
NSHC184J50TRE7F
NSHC224J50TRE8F
Cap.
Value
100pF
120
150
180
220
270
330
390
470
560
680
820
0.001
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
Cap.
Code
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
Size
Code
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
B1
B1
B1
B1
B1
B2
B2
C1
C1
C2
C2
C2
C3
C3
D5
D5
D5
D6
D6
E6
E6
E7
E8
Length
L ±0.2
Width
W
Height
H ±0.2
NSHC Series
p
EIA
2.0
1.25 ± 0.2
0.9
0.45 ± 0.25
0805
0.9
3.2
1.6 ± 0.2
1.1
1.1
3.2
2.5 ± 0.2
1.5
2.1
1.5
4.8
3.3 ± 0.3
2.1
1.9
6.0
4.1 ± 0.3
2.5
2.8
0.80 ± 0.30
2416
0.80 ± 0.30
1913
0.65 ± 0.35
1210
0.65 ± 0.35
1206
OUTLINE DRAWING
Stacked Element Terminations:
95.5% Sn, 4% Ag and
0.5% Cu over phenolic
resin/Ag/Ni/Cu over copper
base
H
p
L
2
L
1
p
W
Stacked Film Capacitor Chips
TAPE AND REEL DIMENSIONS (mm)
Case Code
J1
A1
A2
B1
B2
B3
C2
C3
D5
D6
E6
E7
E8
A±0.1
1.00
1.55
1.55
1.9
1.9
1.9
2.8
2.8
3.8
3.8
4.6
4.6
4.6
B±0.1
1.85
2.3
2.3
3.5
3.5
3.5
3.5
3.5
5.1
5.1
6.3
6.3
6.3
C±0.2
1.0
1.3
1.3
1.5
1.5
1.9
1.9
2.5
2.0
2.6
2.7
3.5
3.5
t ± 0.05
0.20
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.30
0.30
0.30
0.30
0.30
W±0.3
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
F ± 0.05
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
5.50
5.50
5.50
5.50
5.50
P±0.1
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
D+0.2/-0
-
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.5
1.5
-
-
-
E ± 2.0
180
180
180
180
180
180
180
180
330
330
330
330
330
NSHC Series
Qty/Reel
4,000
3,000
3,000
3,000
3,000
2,000
2,000
2,000
3,000
3,000
3,000
2,000
2,000
17.4
±1.0
EMBOSSED PLASTIC CARRIER
t
1.5 +0.1
-0
4.0 ±0.1
1.75
±0.1
13
±0 .0
.5
2.0
±0.5
F
W
.0
21 0.8
±
B
D∅
C
A
P
13.4
±1.0
PART NUMBER SYSTEM
NSHC 103 J 16 TR A2 F
RoHS compliant
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%, G=±2%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
60
±2.0
E
Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 1913, 2416, 2820 AND 2825 SIZES
• WIDE TEMPERATURE RANGE UP TO +105
O
C
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC
ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
Case Sizes
1913
0.01 ~ 0.027μF
2416
2820
0.033 ~ .068μF
0.082 ~ 0.12μF
100Vdc (40Vrms) max.
±5% Std, ±2% Opt.
-55°C ~ +105°C
0.6% max. @ 1KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds
±1%
ΔC
Maximum Over Temperature Range Typical
0.05 ~ 0.10% Typical
NSHC 100V Series
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
includes all homogeneous materials
RoHS
Compliant
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
2825
0.015 ~ 0.22μF
ENVIRONMENTAL CHARACTERISTICS
Life Test At +105°C
1,000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat
+260°C Peak
Humidity Load Life:
1000 Hours, +40°C/95% RH
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Dielectric Withstanding
Within ±2% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±3% of initial value
0.90% maximum @ 1KHz
1 Gigohm minimum
130% of rated voltage for 60 seconds
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE
(maximum 2 times)
300
Peak Temperature 260°C
+250°C 30 sec. max.
Temperature - Deg. C
RECOMMENDED LAND
PATTERN (mm)
EIA Size
1913
2416
2820
2825
A
2.6
3.8
4.5
4.5
B
6.6
7.8
9.0
9.0
C
3.0
3.8
4.6
5.7
250
200
150
100
50
25
Ramp-up
25°C ~ 150°C
90 sec. max.
Pre-heat
150°C ~ 180°C
150 sec. max.
Cool Down
Time above 220°C
90 sec. max.
0
Time
Solder within 6 year. Storage at +35°C and 85% RH
A
B
C
嵌入式系统
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